Zte MG2618, Hardware Manual

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Hardware Development Guide of Module Product
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ZTE MG2618
Tables
Table 1
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1 The function information of module ............................................................................................ 1
Table 1
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2 Major Technical Parameters ........................................................................................................ 1
Table 1
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3 Abbreviation List ......................................................................................................................... 3
Table 2
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1 PIN Interface Definition .............................................................................................................. 6
Table 2
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2 RF Performance of antenna interface .......................................................................................... 8
Table 3
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1 Power Level Range of Digital Signal ........................................................................................ 10
Table 3
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2 Power Consumption of Module (Typical) ................................................................................. 10
Table 3
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3 Module testing environment of temperature .............................................................................. 11
Table 3
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4 ESD Endurance.......................................................................................................................... 12
Table 3
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5 GPS Performance ...................................................................................................................... 12
Table 4
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1 Working Condition .................................................................................................................... 13
Table 4
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2 UART Interface Definition ........................................................................................................ 17
Table 4
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3 Definition of SIM Card Signal .................................................................................................. 18
Table 4
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4 Audio interface definition .......................................................................................................... 19
Table 4
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5 Definition of LED Indicator Status ............................................................................................ 22
Table 6
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1 Baking parameters ..................................................................................................................... 28
Table 6
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2 Recommended PAD dimensions of main board ........................................................................ 30
Table 6
–3 LCC module PAD’s steel mesh opening
................................................................................... 31