Hardware Development Guide of Module Product
All Rights reserved, No Spreading abroad without Permission of ZTE
34
ZTE MG2618
Figure 6
–
7
Module Furnace Temperature Curve Diagram
Note: The test board of furnace temperature must be the main board with the module board mounted
on, and there must be testing points at the position of module board.
6.5.5
Reflow method
If the main board used by customers is a double-sided board, it is recommended to mount the module
board at the second time. In addition, it is preferable for the main board to reflow on the mesh belt when
mounting at the first time and the second time. If such failure is caused by any special reason, the fixture
should be also used to make such main board reflow on the track so as to avoid the deformation of PCB
during the reflow process.
6.5.6
Maintenance of defects
If poor welding occurs to the module board and main board, e.g., pseudo soldering of the module
board and main board, the welder can directly use the soldering iron to repair welding according to the
factory’s normal welding parameters.
