Hardware Development Guide of Module Product
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ZTE MG2618
6.4
Module Planeness Standard
The module’s planeness is required to be 0.15mm. Measurement method: put the module on the
marble plane, use the feeler gage to measure the gap width at the position of maximum warp, and do not
exert force on the module during the measurement.
6.5
Process Routing Selection
The modules are manufactured with the lead-free process and meet the ROHS requirements, therefore
it’s recommended to follow the lead
-free manufacturing process upon the selection of process routing for
module board and main board.
6.5.1
Solder Paste Selection
The solder pastes with metal particle TYPE3 and TYPE4 can fulfill the welding requirements. It is
accordingly recommended to use the no-clean solder paste. If the solder paste which needs cleaning is used,
we cannot guarantee the components on the module board could withstand the washing of the cleaning
solvents. This might cause the functional problems of such components and affect the appearance of the
module. During the printing process
, make sure the solder paste’s thickness at the position of module’s
PAD is within 0.18mm -0.20mm.
6.5.2
Design of module PAD’s steel mesh opening on main board
The thickness of the steel mesh on main board is selected according to the encapsulation type of
components on the main board. Pay attention to the following requirements:
1
）
Make sure to design the module PAD on main board according to section 2.1.
2
）
The thickness of steel mesh is 0.15mm or 0.18mm, but the thickness at the position of module pad
can be increased to 0.18~0.20mm or the thickness of steel mesh is directly 0.18mm~0.20mm on
main board.
3
）
Requirements on the thickness of solder paste: control the thickness between 0.18mm and
0.20mm.
4
）
See the LCC module PAD’s steel mesh opening in the following table:
Table 6
–
3
LCC module PAD’s steel mesh opening
