37
HE4K-DCK-1x & FV4K-DCK-1x
HARDWARE SPECIFICATION
CONFIDENTIAL
DOC-USR-0100-09
____________________________________________________________________________________
Z3 Technology, LLC
♦
100 N. 8th St. STE 250
♦
Lincoln, NE 68508-1369 USA
♦
+1.402.323.0702
7)
Attach the Main Encoder PCB with thermal pieces assembled to the
I/O Jack and PoE PCB
within the
enclosure using four gold hex-head screws.
Figure 18 Attaching Main Encoder PCB to I/O Jack and POE PCB within the Enclosure
8)
Push down the lower portion of the PH3 in the enclosure bottom so that it is making good contact with
the enclosure.
Figure 19 Ensure the Heat Sink Makes Contact with the Enclosure