36
HE4K-DCK-1x & FV4K-DCK-1x
HARDWARE SPECIFICATION
CONFIDENTIAL
DOC-USR-0100-09
____________________________________________________________________________________
Z3 Technology, LLC
♦
100 N. 8th St. STE 250
♦
Lincoln, NE 68508-1369 USA
♦
+1.402.323.0702
3)
Reattach the nut to the 12V power jack on the outside of the enclosure.
Figure 16 Reattach Nut to Power Jack
4)
Attach the heat sink (PH3) to the CPU chip on the
Main Encoder PCB
being careful that it does not
touch other parts. It should be aligned so that approximately 20 mm hangs over the bottom edge of
the PCB.
5)
Attach the "Thermal PAD 3" heat pad to the PH3 directly over the CPU chip.
6)
Bend PH3 where it aligns with the bottom of the PCB.
Figure 17
Attach Heat Sink and “Thermal Pad 3” to Main Encoder PCB
