10
HE4K-DCK-1x & FV4K-DCK-1x
HARDWARE SPECIFICATION
CONFIDENTIAL
DOC-USR-0100-09
____________________________________________________________________________________
Z3 Technology, LLC
♦
100 N. 8th St. STE 250
♦
Lincoln, NE 68508-1369 USA
♦
+1.402.323.0702
Figure 4 EIB-UAV-01 Functional Block Diagram
THERMAL CONSIDERATIONS
The HE4K-DCK-1X and FV4K-DCK-1X encoders consume only about 4W at maximum power operation. The
Sony FCB-ER8300 block camera consumes about 3.5W, so the total power dissipation of the system is
typically around 7.5W.
While a 7.5W power budget is very good, it is still enough power to cause overheating unless proper heat
dissipation methods are employed.
The user is responsible for ensuring that the complete system has enough heat dissipation to ensure
proper operating temperature of all components at all times.
The table below lists the most critical components from the thermal point of view, along with the maximum
junction temperature as specified by the vendor datasheet.
Chip
Location
Max Tj
Notes
CPU
U3, Main Encoder PCB
105 °C
The chip spec is not very clear, and lists
some contradicting values, such as max TJ
of 125 °C and max ambient temperature of
70 °C.
FPGA
U7, Front End PCB
85 °C
Xili
nx specifies a θ
JC
of 10.6 °C/W for this
package (CSG225).
