Xsens MTi 1 Series, Integration Manual

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www.xsens.com iii Document MT1503P.A
© Xsens Technologies B.V. Hardware Integration Manual MTi 1-series
Table of Contents
1 GENERAL INFORMATION
................................................................................................................... 1
2 POWER SUPPLY
................................................................................................................................ 2
2.1 M
AIN SUPPLY VOLTAGE
(VDDIO)
.......................................................................................................... 2
2.2 A
NALOG SUPPLY VOLTAGE
(VDDA)
........................................................................................................ 2
2.3 S
INGLE POWER SUPPLY CONFIGURATION
................................................................................................... 2
2.4 P
OWER SUPPLY SPECIFICATIONS
............................................................................................................. 3
3 INTERFACES
...................................................................................................................................... 4
3.1 P
IN
C
ONFIGURATION
.......................................................................................................................... 4
3.2 C
OMMUNICATION TO HOST
.................................................................................................................. 4
3.2.1 PSEL serial host communication interface selection
................................................................. 5
3.2.2 I
2
C
....................................................................................................................................... 6
3.2.3 SPI
....................................................................................................................................... 7
3.2.4 UART
................................................................................................................................... 7
3.3 GNSS
RECEIVER AND BAROMETER INTERFACE
............................................................................................. 8
3.4 I/O
PINS
......................................................................................................................................... 9
3.4.1 Reset
................................................................................................................................... 9
3.4.2 SYNC_IN
.............................................................................................................................. 9
3.5 DNC/RESERVED
PINS
....................................................................................................................... 9
4 DESIGN
........................................................................................................................................... 10
4.1 PCB
LAYOUT
.................................................................................................................................. 10
4.1.1 Frames of reference used in MTi 1-series
.............................................................................. 10
4.1.2 Origin of measurements
...................................................................................................... 11
4.2 M
ECHANICAL STRESS
........................................................................................................................ 11
4.2.1 Pushbutton contacts
........................................................................................................... 11
4.2.2 Anchor points
..................................................................................................................... 12
4.2.3 Vibrations
.......................................................................................................................... 13
4.2.4 Heat
.................................................................................................................................. 13
4.2.5 Sockets
.............................................................................................................................. 13
4.3 M
AGNETOMETER
............................................................................................................................ 13
4.3.1 Ferromagnetic materials
..................................................................................................... 13
4.3.2 High currents
..................................................................................................................... 13
4.4 F
OOTPRINT
.................................................................................................................................... 14
5 PACKAGING
.................................................................................................................................... 15
5.1 T
RAY PACKAGING INFORMATION
.......................................................................................................... 15
5.2 R
EEL PACKAGING INFORMATION
........................................................................................................... 16
5.3 P
ACKAGE DRAWING
.......................................................................................................................... 17
6 HANDLING
...................................................................................................................................... 18
6.1 R
EFLOW SPECIFICATION
..................................................................................................................... 18
6.2 U
LTRASONIC PROCESSES
.................................................................................................................... 18
6.3 E
LECTROSTATIC DISCHARGE
(ESD)
........................................................................................................ 19