xiC - Technical Manual Version 1.16
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6.3.
Safety instructions and precautions
This chapter describes safety instructions and precautions valid for xiC cameras and special considerations regarding XIMEA
board level cameras. In order to avoid harm or damage your xiC camera, please handle it like described in this manual, paying
special attention to the cautions shown in the following table:
6.3.1.
Disassembling
Do not disassemble the camera except for conversion to CS-Mount, see
There are no switches or parts inside the cameras that requires any kind of mechanical adjustment. Please note that the
warranty is voided by opening the camera housing.
6.3.2.
Mounting / Screwing
Use only the designated threaded holes for mounting the camera. Please note the camera / bracket drawings in chapter
3.5 Model Specific Characteristics
3.18 Tripod Adapter – MECH-MC-BRACKET-KIT
Use only the specified screws and torques when fastening, see
6.3.3.
Connections
Use only recommended connectors and cables. Please check the system requirements described in
6.3.4.
Power supply
xiC camera can be bus powered or powered from external power supply (-UB and –TC models only). The flex line models (-FL, -
FV) could be powered only via the flex cable. For more information see
6.3.5.
Environment / protect against water
Use camera in acceptable environment only, please note the descriptions in
Protect the camera against contact with water. Do not let camera get wet.
Damages may be caused by:
•
Overheating
•
Contact with water
•
Operation in an environment with condensing humidity
•
Mechanical shock
6.3.6.
Recommended light conditions.
Do not expose the camera to light sources with intense energy, e.g. laser beams or X-ray.
Light intensity or exposure time exceeding the saturation of the sensor may damage the sensor irreparably. This may occur e.g.
in the following situations:
•
High-energy laser light hitting the sensor directly
•
Bright light sources hitting the sensor directly (burn-in)
•
Camera is exposed to X-rays
The warranty does not cover damaged cameras caused by X-ray applications or very high intensity light / laser light.
