WIFI232-B2 User Manual
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NO.
Item
Temperature
Time (Sec)
1
Reflow Time
above 220°C
35~55 sec
2
Peak-Temp
260 max
Note:
1.
Recommend to supply N2 for reflow oven
2.
N2 atmosphere during reflow (O2 < 300ppm)
2.5.2
Device Handing Instruction
➢
Shelf life in sealed bag: 12 months, at <30°C and
<60%relative humidity (RH)
➢
After bag is opened, devices that will be re-baked required after last baked
with window time 169 hours.
➢
Recommend to oven bake with N2 supplied
➢
Baked required with 24 hours at 125
±5°
C before rework process for two
modules, one is new module and two is board with module.
➢
Recommend to store at
≤
10% RH with vacuum packing
➢
If SMT process needs twice reflow
(1) Top side (2) Bottom side
Case 1: Wi-Fi module mounted on top side. Need to bake when bottom side process
over 168 hours window time, no need to bake within 168 hours.
Case 2: Wi-Fi module mounted on bottom side, follow normal bake rule before process.
Note:
Window time means from last bake end to next reflow start that has 168 hours space
Table 2 Reflow Soldering Parameter
Figure 5 Reflow Soldering Profile
