Thermal Considerations
67
VL-EPU-4012 Hardware Reference Manual
Installing VersaLogic Thermal Solutions
The following thermal solution accessories are available from VersaLogic:
VL-HDW-401 – Thermal Compound Paste – used to mount the heat sink to the heat plate
VL-HDW-416 – Passive Heat Sink – mounts to standard product.
VL-HDW-415 Fan Assembly – Cooling fan for the HDW-416 passive heatsink. Operates at
+12 V and includes an EPU-4012 compatible connector
VL-HDW-408 Heat Pipe Block – mounts to heat plate
Hardware Assembly
There are two basic assembly methods:
Heat plate down (in relation to the enclosure)
Heat plate up
These assembly methods are shown in Figure 36 and Figure 37, respectively.
Heat Plate Down
The next figure (a representative image of a similar VersaLogic product) shows the assembly.
Use this assembly method if you are attaching the Owl to a larger thermal solution such as a
metal chassis/enclosure.
Figure 36. An Example of Hardware Assembly with Heat Plate Down
A thermal interface compound must be applied to the heat plate to bond it to the mounting plate
or other surface to which the Owl is mounted. Spread the compound thinly and evenly across the
entire heat plate surface before mounting. The compound is supplied in the VL-CKR-OWL cable
kit or sold separately as part number VL-HDW-401.
