u-blox LEON-G100 ECALL System Integration Manual Download Page 5

Page: 5 / 125

LEON-G100 / LEON-G200 - System Integration Manual

GSM.G1-HW-09002-G3

Preliminary

Contents

Page 5 of 125

Design-in checklist .............................................................................................................................. 83

2.1.1

Schematic checklist ..................................................................................................................... 83

2.1.2

Layout checklist ........................................................................................................................... 83

2.1.3

Antenna checklist ........................................................................................................................ 84

2.2

Design Guidelines for Layout .............................................................................................................. 84

2.2.1

Layout guidelines per pin function ............................................................................................... 84

2.2.2

Footprint and paste mask ............................................................................................................ 90

2.2.3

Placement ................................................................................................................................... 92

2.3

Module thermal resistance .................................................................................................................. 92

2.4

Antenna guidelines ............................................................................................................................. 93

2.4.1

Antenna termination ................................................................................................................... 94

2.4.2

Antenna radiation ....................................................................................................................... 95

2.4.3

Antenna detection functionality .................................................................................................. 97

2.5

ESD Immunity Test Precautions ........................................................................................................... 99

2.5.1

General precautions .................................................................................................................. 100

2.5.2

Antenna interface precautions ................................................................................................... 102

2.5.3

Module interfaces precautions ................................................................................................... 103

Feature description .................................................................................................. 104

3.1

Firmware (upgrade) Over The Air (FOTA) (LEON-G200 only) .............................................................. 104

3.2

Firmware (upgrade) Over AT (FOAT) ................................................................................................. 104

3.2.1

Overview ................................................................................................................................... 104

3.2.2

FOAT procedure ........................................................................................................................ 104

3.3

Firewall ............................................................................................................................................. 104

3.4

TCP/IP ............................................................................................................................................... 104

3.4.1

Multiple IP addresses and sockets .............................................................................................. 104

3.5

FTP ................................................................................................................................................... 105

3.6

HTTP ................................................................................................................................................. 105

3.7

SMTP ................................................................................................................................................ 105

3.8

GPS .................................................................................................................................................. 105

3.9

Jamming detection ........................................................................................................................... 105

3.10

Smart Temperature Management ................................................................................................. 106

3.10.1

Smart Temperature Supervisor (STS) .......................................................................................... 106

3.10.2

Threshold Definitions ................................................................................................................. 108

3.11

Hybrid positioning and CellLocate

.............................................................................................. 108

3.11.1

Positioning through cellular information: CellLocate

............................................................... 108

3.11.2

Hybrid positioning ..................................................................................................................... 110

Handling and soldering ........................................................................................... 111

4.1

Packaging, shipping, storage and moisture preconditioning ............................................................. 111

4.2

Soldering .......................................................................................................................................... 111

4.2.1

Soldering paste.......................................................................................................................... 111

4.2.2

Reflow soldering ....................................................................................................................... 111

4.2.3

Optical inspection ...................................................................................................................... 113

4.2.4

Cleaning .................................................................................................................................... 113

Summary of Contents for LEON-G100 ECALL

Page 1: ...m locate communicate accelerate Abstract This document describes the features and integration of the LEON G100 G200 quad band GSM GPRS data and voice modules The LEON G100 G200 are complete and cost efficient solutions bringing full feature quad band GSM GPRS data and voice transmission technology in a compact form factor ...

Page 2: ...1 SW 10008 GSM G1 SW 10012 GSM G1 SW 10013 GSM G1 SW 12002 UBX TN 13001 GSM G1 SW 10012 GSM G1 SW 12002 LEON G100 ECALL LEON G100 71S 00 TBD TBD LEON G200 LEON G200 04S 00 LEON G200 05S 00 LEON G200 06S 00 LEON G200 06S 01 07 40 00 07 50 00 07 60 00 07 60 02 GSM G1 SW 10007 GSM G1 SW 10008 GSM G1 SW 10012 GSM G1 SW 10013 This document and the use of any information contained therein is subject to ...

Page 3: ...ture It is not necessary to read it from the beginning to the end The following symbols are used to highlight important information within the manual An index finger points out key information pertaining to module integration and performance A warning symbol indicates actions that could negatively impact or damage the module Questions If you have any questions about u blox Wireless Integration ple...

Page 4: ...dule power on 32 1 6 2 Module power off 36 1 6 3 Module reset 37 1 6 4 Note Tri stated external signal 40 1 7 RF connection 40 1 8 SIM interface 41 1 8 1 SIM functionality 42 1 9 Serial Communication 43 1 9 1 Asynchronous serial interface UART 43 1 9 2 DDC I 2 C interface 55 1 10 Audio 60 1 10 1 Analog Audio interface 60 1 10 2 Digital Audio interface 66 1 10 3 Voice band processing system 69 1 11...

Page 5: ...le interfaces precautions 103 3 Feature description 104 3 1 Firmware upgrade Over The Air FOTA LEON G200 only 104 3 2 Firmware upgrade Over AT FOAT 104 3 2 1 Overview 104 3 2 2 FOAT procedure 104 3 3 Firewall 104 3 4 TCP IP 104 3 4 1 Multiple IP addresses and sockets 104 3 5 FTP 105 3 6 HTTP 105 3 7 SMTP 105 3 8 GPS 105 3 9 Jamming detection 105 3 10 Smart Temperature Management 106 3 10 1 Smart T...

Page 6: ... 113 4 2 9 Conformal coating 113 4 2 10 Casting 114 4 2 11 Grounding metal covers 114 4 2 12 Use of ultrasonic processes 114 5 Product Testing 115 5 1 u blox in series production test 115 5 2 Test parameters for OEM manufacturer 115 5 2 1 Go No go tests for integrated devices 116 5 2 2 Functional tests providing RF operation 116 A Glossary 119 Related documents 121 Revision history 122 Contact 125...

Page 7: ...de up to 9 6 kb s Encryption algorithms A5 1 for GSM and GPRS support Bearer service fax Group 3 Class 2 0 support Class B Mobile Stations i e the data module can be attached to both GPRS and GSM services using one service at a time Network operation modes I to III are supported GPRS multi slot class determines the maximum number of timeslots available for upload and download and thus the speed at...

Page 8: ...ower On Reset 26 MHz 32 768 kHz Headset Detection RF Transceiver Power Management Baseband ANT SAW Filter Switch PA Digital Audio Figure 1 LEON G100 block diagram Memory Vcc V_BCKP 26 MHz 32 768 kHz Charger RF Transceiver Power Management Baseband ANT SAW Filter Switch PA UART 2 Analog Audio DDC for GPS GPIO SIM Card Power On Reset Headset Detection Digital Audio Figure 2 LEON G200 block diagram ...

Page 9: ...cts the single antenna input output pin of the module to the suitable RX TX path via its integrated parts Power amplifier Antenna switch RX diplexer SAW band pass filters 26 MHz crystal connected to the digital controlled crystal oscillator to perform the clock reference in active or connected mode 1 2 1 2 Baseband The Baseband block is composed of the following main elements Baseband integrated i...

Page 10: ...pical generated by the module to supply Real Time Clock when VCC supply voltage is within valid operating range See section 1 5 5 VSIM 35 O SIM supply SIM supply automatically generated by the module See section 1 8 V_CHARGE LEON G200 xx 4 I Charger voltage supply input V_CHARGE and CHARGE_SENSE must be externally connected The external supply used as charging source must be voltage and current li...

Page 11: ...rential analog audio output This audio output is used when audio downlink path is Loudspeaker See section 1 10 1 MIC_BIAS2 41 I Second microphone analog signal input and bias output This audio input is used when audio uplink path is set as Headset Microphone See section 1 10 1 MIC_GND2 42 I Second microphone analog reference Local ground of second microphone See section 1 10 1 MIC_GND1 43 I First ...

Page 12: ... changes depending on the operative mode See section 1 11 GPIO GPIO1 20 I O GPIO Add a test point to provide access to the pin for debugging See section 1 12 GPIO2 21 I O GPIO See section 1 12 and section 1 9 2 GPIO3 LEON G100 06x LEON G200 06S or subsequent 23 I O GPIO See section 1 12 and section 1 9 2 GPIO4 LEON G100 06x LEON G200 06S or subsequent 24 I O GPIO See section 1 12 and section 1 9 2...

Page 13: ...icroprocessor runs with 32 kHz as reference oscillator Module does not accept data signals from an external device If power saving is enabled the module automatically enters idle mode whenever possible If hardware flow control is enabled the CTS line indicates that the module is in active mode and the UART interface is enabled the line is driven in the OFF state when the module is not prepared to ...

Page 14: ...e is switched off and cannot be switched on not powered mode The Pre Charge phase of the charging process is enabled charging of the deeply discharged battery is forced by HW at low current while the module is switched off When battery voltage level reaches the VCC normal operating range with a charger connected to V_CHARGE and CHARGE_SENSE inputs the module enters charge mode Charge mode Battery ...

Page 15: ... If the VCC voltage is under the minimum specified extended limit the RTC can be externally supplied via V_BCKP pin When a 1 8 V or a 3 V SIM card type is connected LEON G100 LEON G200 automatically supply the SIM card via VSIM pin Activation and deactivation of the SIM interface with automatic voltage switch from 1 8 to 3 V is implemented in accordance to the ISO IEC 78 16 e specifications The in...

Page 16: ...a Sheet 1 Complete functionality of the module is only guaranteed within the specified operational normal voltage range The module cannot be switched on if the VCC voltage value is below the specified normal operating range minimum limit ensure that the input voltage at VCC pin is above the minimum limit of the normal operating range for more than 1 second after the start of the switch on of the m...

Page 17: ...nterfaces and also directly supplies the RF power amplifier PA 1 5 2 1 VCC application circuits The LEON module must be supplied through the VCC pin by one and only one proper DC power supply from the following Switching regulator Low Drop Out LDO linear regulator Rechargeable Li Ion battery Primary disposable battery Time undershoot overshoot ripple ripple drop Voltage 3 8 V typ RX slot unused sl...

Page 18: ... rating for VCC The use of primary disposable batteries is uncommon since the typical cells available are seldom capable of delivering the burst peak current for a GSM call due to high internal resistance The following sections highlight some design aspects for each of these supplies Switching regulator The characteristics of the switching regulator connected to the VCC pin should meet the followi...

Page 19: ... down regulator Reference Description Part Number Manufacturer C1 47 µF Capacitor Aluminum 0810 50 V MAL215371479E3 Vishay C2 10 µF Capacitor Ceramic X7R 5750 15 50 V C5750X7R1H106MB TDK C3 10 nF Capacitor Ceramic X7R 0402 10 16 V GRM155R71C103KA01 Murata C4 680 pF Capacitor Ceramic X7R 0402 10 16 V GRM155R71H681KA01 Murata C5 22 pF Capacitor Ceramic COG 0402 5 25 V GRM1555C1H220JZ01 Murata C6 10 ...

Page 20: ...geo R5 39 kΩ Resistor 0402 5 0 063 W RC0402JR 0739KL Yageo U1 Step Down Regulator 8 VFQFPN 3 A 1 MHz L5987TR ST Microelectronics Table 5 Suggested components for VCC voltage supply application circuit using a low cost step down regulator Low Drop Out LDO linear regulator The characteristics of the LDO linear regulator connected to VCC pin should meet the following requirements Power capabilities t...

Page 21: ...imum average current consumption to VCC pin The maximum pulse discharge current and the maximum DC discharge current are not always reported in batteries data sheet but the maximum DC discharge current is typically almost equal to the battery capacity in Ampere hours divided by 1 hour DC series resistance the rechargeable Li Ion battery with its output circuit has to be capable to avoid a VCC volt...

Page 22: ...urrent consumption on the VCC supply can rise up to 2 5 A in the worst case place a 330 µF low ESR capacitor e g KEMET T520D337M006ATE045 located near VCC pin of LEON G100 LEON G200 To reduce voltage ripple and noise place near VCC pin of the LEON G100 LEON G200 the following components 100 nF capacitor e g Murata GRM155R61A104K to filter digital logic noises from clocks and data sources 10 nF cap...

Page 23: ...s low current period The more relevant contribution to determine the average current consumption is set by the transmitted power in the transmit slot Figure 10 shows an example of current consumption profile of the data module in GSM talk mode Time ms RX slot unused slot unused slot TX slot unused slot unused slot MON slot unused slot RX slot unused slot unused slot TX slot unused slot unused slot...

Page 24: ...istered or attached to a network and a voice or data call is not enabled the module automatically enters idle mode whenever possible but it must periodically monitor the paging channel of the current base station paging block reception in accordance to GSM system requirements When the module monitors the paging channel it wakes up to active mode to enable the reception of paging block In between t...

Page 25: ...paging block reception 1 5 3 3 Current consumption profiles Fixed active mode power saving disabled Power saving configuration is by default disabled or it can be disabled using the appropriate AT command refer to u blox AT Commands Manual 2 AT UPSV command When power saving is disabled the module doesn t automatically enter idle mode whenever possible the module remains in active mode The module ...

Page 26: ... is provided with integrated circuitry and software Two pins are available to connect the positive pole of the external DC supply used as charger Name Description Remarks V_CHARGE Charger Voltage Supply Input V_CHARGE and CHARGE_SENSE pins must be externally connected together CHARGE_SENSE Charger Voltage Measurement Input V_CHARGE and CHARGE_SENSE pins must be externally connected together Table ...

Page 27: ...f the voltage provided to V_CHARGE and CHARGE_SENSE pins are within the operating range limits 5 6 V minimum 15 V maximum If the module is switched off the charger circuitry generates the power on in charging mode after charger detection The algorithm that controls battery charging implements a classic Li Ion battery charging process divided into 4 phases 1 Pre Charge at low current for deeply dis...

Page 28: ...e battery is maintained at a higher level of charge with the trickle charge algorithm until an external charger is connected to the module The charging process is enabled only within the temperature range from 0 C to 40 C with a 5 C hysteresis to prevent rapid switching on and off as the temperature drifts around the set point charging is disabled when the temperature falls below 0 C and then enab...

Page 29: ...sed as charging source must be current limited with a proper current limit Minimum current A minimum acceptable value for the charging current is not specified but the charging current value should be large enough to perform the whole battery charging process within the time interval defined by the application and the charging current value should be greater than the highest possible average curre...

Page 30: ...C charging current equal to 600 mA For example Figure 16 shows the valid area for the charger V I output characteristics using a battery with a maximum DC charging current greater than 1000 mA the maximum acceptable charging current is defined by the module requirement 1000 mA 16 15 0 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 800 700 500 400 300 200 100 0 900 600 1100 mA V 5 6 1000 Figure 16 Valid area f...

Page 31: ...e and time to run even when the main supply is not provided to the module The module cannot switch on if a valid voltage is not present on VCC even when RTC is supplied through V_BCKP meaning that VCC is mandatory to switch on the module If V_BCKP is left unconnected and the main voltage supply of the module is removed from VCC the RTC is supplied from the 1 µF buffer capacitor mounted inside the ...

Page 32: ...a 2 0 V nominal voltage and must not exceed the maximum operating voltage value of 2 25 V can be connected to the V_BCKP pin with a proper series resistor and a proper series diode The purpose of the series resistor is to limit the battery charging current due to the battery specifications and also to let a fast rise time of the voltage value at the V_BCKP pin after VCC supply has been provided Th...

Page 33: ... shorts the PWR_ON pin to ground the V_BCKP supply pin of the module can be used to bias the pull up resistor If PWR_ON input is connected to an external device e g application processor it is suggested to use an open drain output of the external device with an external pull up Connect the pull up the V_BCKP supply pin of the module If PWR_ON pin is connected to a push pull output pin of an applic...

Page 34: ...off the module is by means of the AT CPWROFF command When the module is in power off mode i e the AT CPWROFF command has been sent and a voltage value within the normal operating range limits is still provided to the VCC pin the digital input output pads of the baseband chipset i e all the digital pins of the module are locked in tri state i e floating The power down tri state function isolates th...

Page 35: ...eset state to the default operational configuration The module is fully ready to operate when all the interfaces are configured VCC V_BCKP PWR_ON LDOs RESET_N System State BB Pads State Reset Operational Operational Tristate Floating Reset OFF ON Start up event 0 ms 22 ms 23 ms 45 ms 1500 ms PWR_ON can be set high Start of interfaces configuration All interfaces are configured Figure 19 Power on s...

Page 36: ... pulls the RESET_N pin low to indicate that it is in power off mode all the digital pins are locked in tri state by the module and all the internal LDO voltage regulators except the RTC supply V_BCKP are turned off in a defined power off sequence The module remains in power off mode as long as a switch on event doesn t occur i e a low level on the PWR_ON pin or an RTC alarm or a charger detection ...

Page 37: ...THSG varistor array on the line connected to this pin if it is externally accessible on the application board For more details about the general precautions for ESD immunity about RESET_N pin refer to chapter 2 5 1 The reset state of each digital pin is reported in the pin description table in the LEON G100 LEON G200 Data Sheet 1 The electrical characteristics of RESET_N are different from the oth...

Page 38: ... Schottky diode integrated in the module as protection illustrated in Figure 21 and Figure 22 by means of a very weak pull down One of the following application circuits can be implemented to determine the RESET_N status RESET_N connected to an LED that emits light when the module is powered up and not in reset state and doesn t emit light otherwise through a biased inverting NPN transistor with a...

Page 39: ...ense if the module is in the reset state The RESET_N is set low by the module for 160 µs to indicate that an internal reset occurs The exact low level time interval depends on the implemented circuit since the fall time of the RESET_N low pulse depends on the pull down value which must be greater or equal to 680 kΩ For example if LEON RESET_N pin is connected through a 680 kΩ pull down resistor to...

Page 40: ...equence 1 7 RF connection The ANT pin has 50 Ω nominal impedance and must be connected to the antenna through a 50 Ω transmission line to allow transmission and reception of radio frequency RF signals in the GSM operating bands Name Description Remarks ANT RF antenna 50 nominal impedance Table 13 Antenna pin ANT port ESD immunity rating is 4 kV according to IEC 61000 4 2 A higher protection level ...

Page 41: ...es determined by the SIM Card Table 14 describes the pins related to the SIM interface Name Description Remarks VSIM SIM supply 1 80 V typical or 2 85 V typical automatically generated by the module SIM_CLK SIM clock 3 25 MHz clock frequency SIM_IO SIM data Internal 4 7 kΩ pull up to VSIM SIM_RST SIM reset Table 14 SIM Interface pins A low capacitance i e less than 10 pF ESD protection device e g ...

Page 42: ...e to a SIM card holder perform the following steps on the application board Bypass digital noise via a 100 nF capacitor e g Murata GRM155R71C104KA01 on the SIM supply VSIM To prevent RF coupling connect a 47 pF bypass capacitor e g Murata GRM1555C1H470JZ01 at each SIM signal VSIM SIM_CLK SIM_IO SIM_RST to ground near the SIM connector Mount very low capacitance i e less than 10 pF ESD protection d...

Page 43: ...7 Data set ready RI Ring Indicator Module output functionality of ITU T V 24 Circuit 125 Calling indicator DCD Data carrier detect Module output functionality of ITU T V 24 Circuit 109 Data channel received line signal detector DTR Data terminal ready Module input functionality of ITU T V 24 Circuit 108 2 Data terminal ready Internal active pull up to 2 85 V enabled RTS Ready to send Module hardwa...

Page 44: ...re flow control is disabled The following baud rates can be configured using AT commands 2400 b s 4800 b s 9600 b s 19200 b s 38400 b s 57600 b s 115200 b s default value when autobauding is disabled The following baud rates are available with autobauding only 1200 b s 230400 b s Automatic frame recognition is supported this feature is enabled in conjunction with autobauding only which is enabled ...

Page 45: ...active mode and the UART interface is enabled the module drives the CTS line to the ON state or to the OFF state when it is either able or not able to accept data from the DTE refer to chapter 1 9 1 3 for the complete description If the hardware flow control is not enabled the CTS line is always held in the ON state after UART initialization When the power saving configuration is enabled and the h...

Page 46: ...te If AT C1 is set the DCD module output line is set by default to OFF state high level at UART initialization The DCD line is then set by the module in accordance with the carrier detect status ON if the carrier is detected OFF otherwise In case of voice call DCD is set to ON state when the call is established For a data call there are the following scenarios GPRS data communication Before activa...

Page 47: ... received SMSes In case of multiple events incoming call plus SMS received the RI line can t be used to discriminate between the two events but the DTE must rely on the subsequent URCs and interrogate the DCE with the proper commands 1 9 1 3 UART and power saving The power saving configuration is controlled by the AT UPSV command for the complete description refer to u blox AT Commands Manual 2 AT...

Page 48: ...sition occurs on the RTS input line the module switches from idle mode to active mode after 20 ms this is the wake up time of the module 2 Disabled AT K0 OFF When a low to high transition occurs on the TxD input line the module switches from idle mode to active mode after 20 ms this is the wake up time of the module As a consequence the first character sent when the module is in idle mode i e the ...

Page 49: ...case if the RTS line is set to OFF by the DTE When an OFF to ON transition occurs on the RTS input line the module switches from idle mode to active mode after 20 ms and then the module doesn t enter the idle mode until the RTS input line is held in the ON state This configuration can only be enabled with the module HW flow control disabled Even if HW flow control is disabled if the RTS line is se...

Page 50: ...le is in idle mode i e the wake up character won t be a valid communication character because it can t be recognized and the recognition of the subsequent characters is guaranteed only after the complete wake up i e after 20 ms Figure 29 and Figure 30 show an example of common scenarios and timing constraints HW flow control set in the DCE and no HW flow control set in the DTE needed to see the CT...

Page 51: ...HW flow control is not implemented by the DTE the DTE must always send a character to the module before the AT prefix set at the beginning of each command line the first character will be ignored if the module is in active mode or it will represent the wake up character if the module is in idle mode In command mode if autobauding is disabled the DTE must always send a dummy AT to the module before...

Page 52: ...xD Application Processor DTE RxD RTS CTS DTR DSR RI DCD GND 15 TXD 12 DTR 16 RXD 13 RTS 14 CTS 9 DSR 10 RI 11 DCD GND 0 Ω 0 Ω TP TP Figure 32 UART interface application circuit with partial V 24 link 5 wire in the DTE DCE serial communication If only TxD RxD RTS and CTS lines are provided as described in Figure 32 the procedure to enable the power saving depends on the HW flow control status If HW...

Page 53: ...ntil the module is in active mode A data delivered by the DTE can be lost using this configuration and the following settings o HW flow control enabled in the module AT K3 that is the default setting o Module power saving enabled by AT UPSV 1 o HW flow control disabled in the DTE In this case the first character sent when the module is in idle mode will be a wake up character and won t be a valid ...

Page 54: ...vide access to the enabling of the DC supply connected to the VCC pin to start the module firmware upgrade over the UART 1 9 1 5 MUX Protocol 3GPP 27 010 The module has a software layer with MUX functionality complaint with 3GPP 27 010 7 This is a data link protocol layer 2 of OSI model using HDLC like framing and operates between the module DCE and the application processor DTE The protocol allow...

Page 55: ...hey are externally accessible on the application board u blox has implemented special features in LEON G100 LEON G200 modules to ease the design effort required to integrate a u blox wireless module with a u blox GPS receiver Combining a LEON G100 LEON G200 wireless module with a u blox GPS receiver allows designers full access to the GPS receiver directly via the wireless module it relays control...

Page 56: ...to GND If the pull ups are missing SCL and SDA lines are undefined and the DDC bus will not work The signal shape is defined by the values of the pull up resistors and the bus capacitance Long wires on the bus will increase the capacitance If the bus capacitance is increased use pull up resistors with nominal resistance value lower than 4 7 k to match the I 2 C bus specifications 8 regarding rise ...

Page 57: ...ower saving is enabled GPIO4 is by default configured to provide the GPS RTC sharing function parameter gpio_mode of AT UGPIOC command set to 5 by default to provide a synchronization timing signal at the power up of the u blox GPS receiver connected to the wireless module The pin is set as Output to provide a synchronization timing signal to the u blox GPS receiver for RTC sharing if the paramete...

Page 58: ... 05S versions support 3 different types of GPS aiding Local aiding AssistNow Online AssistNow Offline The embedded GPS aiding features can be used only if the DDC I 2 C interface of the wireless module is connected to a u blox GPS receiver GPIO pins can handle the power on off of the GPS receiver GPS supply enable function provided by GPIO2 GPS data ready and GPS RTC sharing functions are not avai...

Page 59: ...he supply for the GPS real time clock and backup RAM when the VCC supply of the wireless module is within its operating range and the VCC supply of the GPS receiver is disabled This enables the u blox GPS receiver to recover from a power outage with either a hot start or a warm start depending on the duration of the GPS VCC outage and to maintain the configuration settings saved in the backup RAM ...

Page 60: ...t_sound parameters Headset detection input If enabled causes the automatic switch of uplink audio path to Headset Microphone and downlink audio path to Mono headset Enabling disabling the detection can be controlled by parameter headset_indication in AT USPM command refer to u blox AT Commands Manual 2 I 2 S digital audio interface This path is selected when parameters main_uplink and main_downlin...

Page 61: ...alog audio This audio output is used when audio downlink path is Normal earpiece or Mono headset SPK_P Second speaker output with high power differential analog audio This audio output is used when audio downlink path is Loudspeaker SPK_N Second speaker output with power differential analog audio output This audio output is used when audio downlink path is Loudspeaker MIC_BIAS2 Second microphone a...

Page 62: ...ed Mount a 82 nH series inductor e g Murata LQG15HS82NJ02 on each microphone line and a 27 pF bypass capacitor e g Murata GRM1555C1H270J on all audio lines to minimize RF coupling and TDMA noise LEON G100 LEON G200 C1 AUDIO HANDSET CONNECTOR C2 C3 J1 4 3 2 1 L1 L2 37 HS_P 43 MIC_GND1 44 MIC_BIAS1 C4 D1 Figure 36 Handset connector application circuit Reference Description Part Number Manufacturer C...

Page 63: ...2 C3 J1 2 5 3 4 6 1 L1 L2 18 HS_DET 37 HS_P 42 MIC_GND2 41 MIC_BIAS2 D1 Figure 37 Headset mode application circuit Reference Description Part Number Manufacturer C1 C2 C3 27 pF Capacitor Ceramic COG 0402 5 25 V GRM1555C1H270JZ01 Murata C4 10 µF Capacitor Ceramic X5R 0603 20 6 3V GRM188R60J106M Murata L1 L2 82nH Multilayer inductor 0402 self resonance frequency 1 GHz LQG15HS82NJ02 Murata J1 Audio H...

Page 64: ...ion circuit Reference Description Part Number Manufacturer C1 C2 C3 C4 27 pF Capacitor Ceramic COG 0402 5 25 V GRM1555C1H270JZ01 Murata L1 L2 82nH Multilayer inductor 0402 self resonance frequency 1 GHz LQG15HS82NJ02 Murata SPK Loudspeaker MIC Active Elected Microphone Table 24 Example of components for hands free connection 1 10 1 6 Connection to an external analog audio device MIC_BIAS1 MIC_GND ...

Page 65: ... is provided with a differential analog audio output a proper differential to single ended circuit must be inserted from the differential output of the external audio device to the MIC_BIAS1 single ended input of the module Figure 39 describes a simple application circuit a DC block 10 µF series capacitor e g Murata GRM188R60J106M is provided to decouple the bias present at the module input and a ...

Page 66: ...ey are externally accessible on the application board The I 2 S interface can be can be used in two modes PCM mode I2Sx Normal I 2 S mode I2Sy Beyond the supported transmission modality the main difference between the PCM mode and the normal I 2 S mode is represented by the logical connection to the digital audio processing system integrated in the chipset firmware see Figure 41 PCM mode provides ...

Page 67: ...he analog front end I2S_RX and I2S_TX as internal connections to the voice processing system see Figure 41 so resources available for analog path can be shared Digital filters and digital gains are available in both uplink and downlink direction They can be configured using AT commands refer to the u blox AT Commands Manual 2 Ringer tone and service tone are mixed on the TX path when active downli...

Page 68: ...ation MSB is transmitted first The MSB is first transmitted the bits change on I2S_CLK rising or falling edge configurable I2S_RX data are read on the I2S_CLK edge opposite to I2S_TX writing edge I2S_CLK frequency depends by the number of bits and number of channels so is 16 x 2 x 8 kHz 256 kHz The modes are configurable through a specific AT command refer to u blox AT Commands Manual 2 and the fo...

Page 69: ...ink filter 1 Hands free To Radio TX Scal_Mic Digital Gain Sidetone Downlink filter 1 Downlink filter 2 MIDI player SPK_P N HS_P HS Analog_gain Switch Switch I2Sx TX I2S_TXD Scal_Rec Digital Gain Mix_AFE Digital Gain SPK Analog_gain Gain_out Digital Gain Tone Generator Switch I2Sy TX From Radio RX Speech level I2Sx RX Sample Based Processing Frame Based Processing AMR Player Circular buffer Voiceba...

Page 70: ...ated AT commands and be saved in 2 customer profiles in the non volatile memory of the module refer to the u blox AT Commands Manual 2 1 10 3 4 Ringer mode LEON G100 LEON G200 modules support polyphonic ring tones The ringer tones are generated by a built in generator on the chipset and then amplified by the internal amplifier The synthesizer output is only mono and cannot be mixed with TCH voice ...

Page 71: ...alent of the electrical network developed on the application board If an external voltage divider is implemented to increase the voltage range check the input resistance in measurement mode Req of ADC1 input and all the electrical characteristics If the Thévenin s equivalent of the voltage source Usig has a significant internal resistance Rsig compared to the input resistance in measurement mode R...

Page 72: ... in mV applied in the calibration procedure ADC_1 the AT UADC 0 response when V_1 is applied ADC_2 the AT UADC 0 response when V_2 is applied This is the procedure to calibrate the ADC 1 Apply V_1 2 Read ADC_1 3 Apply V_2 4 Read ADC_2 5 Evaluate GAIN value with the following formula 2 _ ADC 1 _ ADC 2 _ V 1 _ V 16384 GAIN 6 Evaluate OFFSET value with the following formula GAIN 8192 2 _ V 1 _ V ADC_...

Page 73: ...et to 1 o Output Low to switch off the u blox GPS receiver if the parameter mode of AT UGPS command is set to 0 default setting The pin configured to provide the GPS supply enable function must be connected to the active high enable pin or the active low shutdown pin of the voltage regulator that supplies the u blox GPS receiver on the application board GPS data ready GPIO3 is by default configure...

Page 74: ...configured to provide the Network status indication function The pin configured to provide the Network status indication function is set as o Continuous Output Low if no service no network coverage or not registered o Cyclic Output High for 100 ms Output Low for 2 s if registered home network o Cyclic Output High for 100 ms Output Low for 100 ms Output High for 100 ms Output Low for 2 s if registe...

Page 75: ...PIO2 can be configured to indicate network status i e no service registered home network registered roaming voice or data call enabled setting the parameter gpio_mode of AT UGPIOC AT command to 2 No GPIO pin is by default configured to provide the Network status indication function The pin configured to provide the Network status indication function is set as o Continuous Output Low if no service ...

Page 76: ...le Name Description Remarks 20 LEON Gx00 04S LEON Gx00 05S GPIO1 GPIO By default the pin is configured as Output Low Can be alternatively configured by the AT UGPIOC command as Input function Network Status Indication function GPS Supply Enable function LEON G100 06x LEON G200 06S or subsequent GPIO1 GPIO By default the pin is configured as Pad disabled Can be alternatively configured by the AT UG...

Page 77: ...GPIO By default the pin is configured to provide the Headset detection function Can be alternatively configured by the AT UGPIOC command as Output function Input function Network Status Indication function GPS Supply Enable function Pad disabled function Table 28 GPIO pins The GPIO pins ESD sensitivity rating is 1 kV HBM JESD22 A114F A higher protection level could be required if the lines are ext...

Page 78: ...nc R2 10 kΩ Resistor 0402 5 0 1 W Various manufacturers R3 47 kΩ Resistor 0402 5 0 1 W Various manufacturers R4 820 Ω Resistor 0402 5 0 1 W Various manufacturers DL1 LED Red SMT 0603 LTST C190KRKT Lite on Technology Corporation T1 NPN BJT Transistor BC847 Infineon Table 29 Components for GPIO application circuit To avoid an increase of module power consumption any external signal connected to a GP...

Page 79: ...T IN GND LDO Regulator SHDN SDA SCL 4 7k 3V8 3V0_GPS SDA2 SCL2 GPIO3 GPIO4 TxD1 EXTINT0 31 30 23 24 47k VCC GPIO2 21 ANT 47 Antenna 3 0V Digital Audio Device I2S_RXD I2S_CLK I2S_TXD I2S_CLK I2S_TXD I2S_WA I2S_RXD I2S_WA 29 28 27 26 20 GPIO1 3V8 Network Indicator 22 RESET_N Ferrite Bead 47pF 3 0V Application Processor Open Drain Output 19 PWR_ON 100kΩ Open Drain Output 0Ω 0Ω TP TP 10uF Headset Conn...

Page 80: ...ed and operated with a minimum distance of 20 cm between the radiator and your body This transmitter must not be co located or operating in conjunction with any other antenna or transmitter IC Industry Canada Certification Number o LEON G100 8595A LEONG100 o LEON G200 8595A LEONG200 Manufacturers of mobile or fixed devices incorporating LEON G100 LEON G200 modules are authorized to use the FCC Gra...

Page 81: ...eil ne doit pas causer d interférence o cet appareil doit accepter toute interférence notamment les interférences qui peuvent affecter son fonctionnement Informations concernant l exposition aux fréquences radio RF La puissance de sortie émise par l appareil de sans fil u blox Wireless Module est inférieure à la limite d exposition aux fréquences radio d Industrie Canada IC Utilisez l appareil de ...

Page 82: ...ration Manual GSM G1 HW 09002 G3 Preliminary System description Page 82 of 125 ICASA Independent Communications Authority of South Africa ANATEL Brazilian Agency of Telecommunications in Portuguese Agência Nacional de Telecomunicações ...

Page 83: ...citance and series resistance must be limited on each line of the DDC I 2 C interface Insert the suggested passive filtering parts on each used analog audio line Check the digital audio interface specifications to connect a proper device For debug purposes add a test point on each I 2 S pin and on GPIO1 also if they are not used Use transistors with at least an integrated resistor in the base pin ...

Page 84: ...per Antenna detection functionality 2 2 Design Guidelines for Layout The following design guidelines must be met for optimal integration of LEON G100 LEON G200 modules on the final application board 2 2 1 Layout guidelines per pin function This section groups the LEON G100 LEON G200 pins by signal function and provides a ranking of importance in layout design Pinout_Layout_R1 1 ppt GND GND ANT GND...

Page 85: ...minimum loss up to radiating element Provide proper transition between the ANT pad to application board PCB Increase GND keep out i e clearance for ANT pin to at least 250 µm up to adjacent pads metal definition and up to 500 µm on the area below the Data Module as described in Figure 46 Add GND keep out i e clearance on buried metal layers below ANT pad and below any other pad of component presen...

Page 86: ... buried vias should be cut out in order to remove stray capacitance and thus keep the RF line 50 Ω In most cases the large active pad of the integrated antenna or antenna connector needs to have a GND keep out i e clearance at least on first inner layer to reduce parasitic capacitance to ground The layout recommendation is not always available from connector manufacturer e g the classical SMA Pin ...

Page 87: ...e ripple at high frequency may result in unwanted spurious modulation of transmitter RF signal This is especially seen with switching DC DC converters in which case it is better to select the highest operating frequency for the switcher and add a large L C filter before connecting to LEON G100 LEON G200 in the worst case The large current generates a magnetic field that is not well isolated by PCB...

Page 88: ... configurations SPK_P SPK_N are high level balanced output They are DC coupled and must be used with a speaker connected in bridge configuration Route SPK_P SPK_N as differential pair to reduce differential noise pick up The balanced configuration will help reject the common mode noise If audio output is directly connected to speaker transducer given the low load impedance of its load then conside...

Page 89: ...2 2 1 7 Digital pins External Reset RESET_N input for external reset a logic low voltage will reset the module SIM Card Interface VSIM SIM_CLK SIM_IO SIM_RST the SIM layout may be critical if the SIM card is placed far away from LEON G100 LEON G200 or in close vicinity of RF antenna In the first case the long connection may radiate higher harmonic of digital data In the second case the same harmon...

Page 90: ... module by defining the dimensions of the paste mask to form a T shape or equivalent extending beyond the Copper mask The solder paste should have a total thickness of 120 µm The paste mask outline needs to be considered when defining the minimal distance to the next component The exact geometry distances stencil thicknesses and solder paste volumes must be adapted to the specific production proce...

Page 91: ...ion Manual GSM G1 HW 09002 G3 Preliminary Design In Page 91 of 125 Figure 49 Ground copper and signal keep out below data module on application motherboard due to due to VCC area RF ANT pin and exposed GND pad on data module bottom layer ...

Page 92: ... to GND if the application motherboard has unprotected signal routing on same coordinates 2 2 3 Placement Optimize placement for minimum length of RF line and closer path from DC source for VCC 2 3 Module thermal resistance The Case to Ambient thermal resistance RC A of the module with the LEON G100 LEON G200 mounted on a 130 x 110 x 1 6 mm FR4 PCB with a high coverage of copper e g the EVK G25H e...

Page 93: ...es the fulfillment of some minimum guidelines suggested by antenna manufacturer Patch like antenna better suited for integration in compact designs e g mobile phone They are mostly custom designs where the exact definition of the PCB and product mechanical design is fundamental for tuning of antenna characteristics For integration observe these recommendations Ensure 50 Ω antenna termination minim...

Page 94: ...he power is delivered to antenna and which portion is reflected by the antenna back to the modem output A good antenna should have a S11 below 10 dB over the entire frequency band Due to miniaturization mechanical constraints and other design issues this value will not be achieved A value of S11 of about 6 dB in the worst case is acceptable Figure 51 shows an example of this measurement Figure 51 ...

Page 95: ...ned half wavelength dipole and a penta band internal antenna The half lambda dipole tuned to 900 MHz is known to have good radiation performance both for gain and directivity By comparing the S21 measurement with the antenna under investigation for the frequency for which the half dipole is tuned e g marker 3 in Figure 53 it is possible to rate the antenna being tested If the performance of the tw...

Page 96: ...e many of them e g patch antennas monopole are based on a resonating element that works in combination with a ground plane The ground plane ideally infinite can be reduced down to a minimum size that must be similar to one quarter of the wavelength of the minimum frequency that has to be radiated transmitted received Numerical sample frequency 1 GHz wavelength 30 cm minimum ground plane or antenna...

Page 97: ...RF Choke DC Blocking Radiating Element Zo 50 Ohm Resistor for Diagnostic Coaxial Antenna Cable Internal Resistor Figure 55 Module Antenna Detection circuit and antenna with diagnostic resistor Examples of components for the antenna detection diagnostic circuit are reported in the following table Description Part Number Manufacturer DC Blocking Capacitor Murata GRM1555C1H220JA01 or equivalent RF Ch...

Page 98: ... nominal value i e values from 10 kΩ to 20 kΩ if a 15 kΩ diagnostic resistor is used indicate that the antenna is connected Values above the maximum measurement range limit about 53 kΩ indicate that the antenna is not connected Reported values below the minimum measurement range limit about 1 kΩ indicate that the antenna is shorted to GND Measurement inside the valid measurement range and outside ...

Page 99: ... vertical coupling planes 9 Implement the following precautions to satisfy ESD immunity test requirements 9 10 11 performed at the device enclosure in compliance to the category level 10 and shown in Table 33 Application Category Immunity Level All exposed surfaces of the radio equipment and ancillary equipment in a representative configuration Contact Discharge 4 kV Air Discharge 8 kV Table 33 El...

Page 100: ...pin A series Schottky diode is integrated in LEON G100 LEON G200 modules as protection on the RESET_N pin The external circuit must be able to cause a current flow through the series diode to determine the RESET_N state Sensitive interface is the reset line RESET_N pin A 47 pF bypass capacitor e g Murata GRM1555C1H470JA01 have to be mounted on the line termination connected to the RESET_N pin to a...

Page 101: ...0402 5 50 V GRM1555C1H470JA01 Murata FB1 FB2 Chip Ferrite Bead for Noise EMI Suppression BLM15HD182SN1 Murata Rint 10 kΩ Resistor 0402 5 0 1 W Internal pull up resistor Table 35 Example of components as ESD immunity test precautions for the RESET_N line SIM interface Sensitive interface is the SIM interface VSIM pin SIM_RST pin SIM_IO pin SIM_CLK pin A 47 pF bypass capacitor e g Murata GRM1555C1H4...

Page 102: ...r discharge up to 8 kV 8 kV to the whole antenna and cable surfaces the following precautions to ESD immunity test should be implemented on the application board ANT port ESD immunity rating is 4 kV according to IEC 61000 4 2 A higher protection level is required at ANT port if the line is externally accessible on the application board Higher protection level can be achieved with an external high ...

Page 103: ... to the port should be protected up to 4 kV 4 kV for direct Contact Discharge and up to 8 kV 8 kV for Air Discharge applied to the enclosure surface The maximum ESD sensitivity rating of all the pins of the module except the ANT pin is 1 kV Human Body Model according to JESD22 A114F A higher protection level can be achieved by mounting an ESD protection e g EPCOS CA05P4S14THSG varistor array For t...

Page 104: ...tion is performed via a security signature during the download Firmware is then installed overwriting the current version In case of power loss during this phase the boot loader detects a fault at the next wake up and restarts the Firmware download from the Xmodem 1k handshake After completing the upgrade the module is reset again and wakes up in normal boot 3 2 2 FOAT procedure The application pr...

Page 105: ...pplication Note 3 3 9 Jamming detection In real network situations modules can experience various kind of out of coverage conditions limited service conditions when roaming to networks not supporting the specific SIM limited service in cells which are not suitable or barred due to operators choices no cell condition when moving to poorly served or highly interfered areas In the latter case interfe...

Page 106: ...edefined thresholds to identify the actual working temperature range Temperature measurement is done inside the wireless module the measured value could be different from the environmental temperature Ta Warning area t 1 t 1 t 2 t 2 Valid temperature range Safe area Dangerous area Dangerous area Warning area Figure 58 Temperature range and limits The entire temperature range is divided into sub re...

Page 107: ...call in progress Shut the device down Yes No Yes Yes No No No Yes Send shutdown notification Feature enabled full logic or indication only IF Full Logic Enabled Feature disabled no action Temperature is within normal operating range Yes Tempetature is within warning area Tempetature is outside valid temperature range No Featuere enabled in full logic mode Feature enabled in indication only mode no...

Page 108: ... equals the absolute maximum temperature rating Table 37 thresholds definition for Smart Temperature Supervisor 3 11Hybrid positioning and CellLocateTM Although GPS is a widespread technology its reliance on the visibility of extremely weak GPS satellite signals means that positioning is not always possible Especially difficult environments for GPS are indoors in enclosed or underground parking ga...

Page 109: ...25 2 CellLocate TM server defines the area of Cell A visibility 3 If a new device reports the observation of Cell A CellLocate TM is able to provide the estimated position from the area of visibility 4 The visibility of multiple cells provides increased accuracy based on the intersection of areas of visibility ...

Page 110: ...nfiguration of the CellLocate TM service AT ULOCCELL and requesting the position according to the user configuration AT ULOC The answer is provided in the form of an unsolicited AT command including latitude longitude and estimated accuracy if the position has been estimated by CellLocate TM and additional parameters if the position has been computed by the GNSS receiver The configuration of mobil...

Page 111: ...Melting Temperature 217 C Stencil Thickness 120 µm for base boards The final choice of the soldering paste depends on the approved manufacturing procedures The paste mask geometry for applying soldering paste should meet the recommendations in section 2 2 2 The quality of the solder joints on the connectors half vias should meet the appropriate IPC specification 4 2 2 Reflow soldering A convection...

Page 112: ...ure fall rate max 4 C s To avoid falling off modules should be placed on the topside of the motherboard during soldering The final soldering temperature chosen at the factory depends on additional external factors like choice of soldering paste size thickness and properties of the base board etc Exceeding the maximum soldering temperature in the recommended soldering profile may permanently damage...

Page 113: ...5 Repeated reflow soldering Only a single reflow soldering process is encouraged for boards with a LEON G100 LEON G200 module populated on it The reason for this is the risk of the module falling off due to high weight in relation to the adhesive properties of the solder 4 2 6 Wave soldering Boards with combined through hole technology THT components and surface mount technology SMT devices requir...

Page 114: ...r other forms of metal strips directly onto the EMI covers is done at the customer s own risk The numerous ground pins should be sufficient to provide optimum immunity to interferences and noise u blox gives no warranty for damages to the LEON G100 LEON G200 module caused by soldering metal cables or any other forms of metal strips directly onto the EMI covers 4 2 12 Use of ultrasonic processes So...

Page 115: ...al tests GPIOs digital interfaces Measurement and calibration of RF characteristics in all supported bands Receiver S N verification frequency tuning of reference clock calibration of transmitter and receiver power levels Verification of RF characteristics after calibration modulation accuracy power levels and spectrum performances are checked to be within tolerances when calibration parameters ar...

Page 116: ...T Commands Manual 2 AT CSQ command rssi ber parameters These kind of test may be useful as a go no go test but not for RF performance measurements This test is suitable to check the communication with host controller and SIM card the audio and power supply functionality and verify if components at antenna interface are well soldered 5 2 2 Functional tests providing RF operation The command used to...

Page 117: ...received at ANT pin must meet module specifications It is suggested not to exceed power level 15 dBm at antenna input The AT UTEST command sets the module to emit RF power ignoring GSM signalling protocol This emission can generate interference that can be prohibited by law in some countries The use of this feature is intended for testing purpose in controlled environments by qualified user and mu...

Page 118: ...ower supply is correctly assembled and is able to deliver the required current 3 Trigger TX burst o To measure current consumption 4 Trigger RX measurement o To test receiver signal level If no losses between ANT pin and input power source are assumed the estimated module power level can vary approximately within 3GPP tolerances for the average value o To check if module was damaged during solderi...

Page 119: ...SP Digital Signal Processing DSR Data Set Ready DTE Data Terminal Equipment DTR Data Terminal Ready EBU External Bus Interface Unit EEP EEPROM Emulation Parameters EGSM Extended GSM EM ElectroMagnetic EMC Electromagnetic Compatibility EMI ElectroMagnetic Interference EMS ElectroMagnetic Static ESD Electrostatic Discharge ESR Equivalent Series Resistance EUT Equipment Under Test FAQ Frequently Aske...

Page 120: ...l Communications Service PICS Protocol Implementation Conformance Statement PIXIT Protocol Implementation Extra Information for Testing PMU Power Management Unit PPS Protocol and Parameter Selection PSRAM Pseudo Static Random Access Memory RF Radio Frequency RI Ring Indicator RoHS Restriction of Hazardous Substances Directive RTC Real Time Clock RTS Ready To Send RX Receiver RXD RX Data SAR Specif...

Page 121: ...rature 9398 39340011_21 pdf 9 CENELEC EN 61000 4 2 2001 Electromagnetic compatibility EMC Part 4 2 Testing and measurement techniques Electrostatic discharge immunity test 10 ETSI EN 301 489 1 V1 8 1 Electromagnetic compatibility and Radio spectrum Matters ERM ElectroMagnetic Compatibility EMC standard for radio equipment and services Part 1 Common technical requirements 11 ETSI EN 301 489 7 V1 3 ...

Page 122: ...ion circuits to reset the module using a push button or using an application processor Section 1 10 1 3 clarified and updated application circuit description to connect a handset added application circuit description to connect an external audio device with analog input outputs clarified and updated application circuit description to connect a headset Added Figure 20 Section 1 10 1 5 clarified and...

Page 123: ...nna termination Antenna radiation Antenna detection functionality Corrected AT Commands Manual code in Related documents section Removed System Configuration chapter D Jan 29 2010 lpah Improved audio interfaces and updated approvals chapter E Apr 22 2010 lpah Aligned the document to LEON G100 04S 00 and LEON G200 04S 00 Digital Audio Interface supported by LEON G100 F Jul 08 2010 lpah Aligned the ...

Page 124: ...LEON G100 LEON G200 System Integration Manual GSM G1 HW 09002 G3 Preliminary Page 124 of 125 ...

Page 125: ...com Asia Australia Pacific u blox Singapore Pte Ltd Phone 65 6734 3811 E mail info_ap u blox com Support support_ap u blox com Regional Office China Beijing Phone 86 10 68 133 545 E mail info_cn u blox com Support support_cn u blox com Regional Office China Shenzhen Phone 86 755 8627 1083 E mail info_cn u blox com Support support_cn u blox com Regional Office India Phone 91 959 1302 450 E mail inf...

Search results

Summary of Contents for LEON-G100 ECALL

Reviews:

Brands by name

Popular brands

u-blox LEON-G100 ECALL, System Integration Manual

Search results

Summary of Contents for LEON-G100 ECALL

Reviews:

Brands by name

Popular brands