AMY-5M
-
Hardware
Integration
Manual
Objective
Specification
Contents
GPS.G5-MS5-08207
u-blox
proprietary
Page 6
your position is our focus
2.6.1
Schematic
Design-In
Checklist
for
u-blox
5 .................................................................................. 23
2.6.2
AMY-5M
Design ......................................................................................................................... 24
2.6.3
Design
for
AMY-5M .................................................................................................................... 25
2.7
Layout
Design-In
Checklist.................................................................................................................. 27
2.8
Layout ................................................................................................................................................ 28
2.8.1
Footprint ..................................................................................................................................... 28
2.8.2
Paste
Mask .................................................................................................................................. 28
2.8.3
Placement ................................................................................................................................... 29
ESD
Protection
Measures ............................................................................................................................... 30
2.9.1
ESD
Precautions
for
USB.............................................................................................................. 30
2.9.2
ESD
Precautions
for
Antennas ..................................................................................................... 30
3
Product Handling........................................................................................................31
3.1
Packaging........................................................................................................................................... 31
3.1.1
Reels ........................................................................................................................................... 31
3.1.2
Tapes .......................................................................................................................................... 32
3.2
Shipment,
Storage
and
Handling ........................................................................................................ 32
3.2.1
Handling ..................................................................................................................................... 32
3.2.2
Shipment..................................................................................................................................... 32
3.2.3
Storage ....................................................................................................................................... 33
3.2.4
Handling ..................................................................................................................................... 33
3.2.5
Floor
Life ..................................................................................................................................... 34
3.3
Processing .......................................................................................................................................... 35
3.3.1
Moisture
Preconditioning ............................................................................................................ 35
3.3.2
Soldering
Paste............................................................................................................................ 35
3.3.3
Reflow
Soldering ......................................................................................................................... 36
3.3.4
Optical
Inspection........................................................................................................................ 37
3.3.5
Cleaning...................................................................................................................................... 38
3.3.6
Repeated
Reflow
Soldering.......................................................................................................... 38
3.3.7
Wave
Soldering ........................................................................................................................... 38
3.3.8
Hand
Soldering ........................................................................................................................... 38
3.3.9
Rework........................................................................................................................................ 38
3.3.10
Conformal
Coating ..................................................................................................................... 39
3.3.11
Casting........................................................................................................................................ 39
3.3.12
Grounding
Metal
Covers ............................................................................................................. 39
3.3.13
Use
of
Ultrasonic
Processes.......................................................................................................... 39
3.4
ESD
Handling
Precautions................................................................................................................... 40