(*1)
GREEN PRODUCT PROCUREMENT
The EC is actively promoting the WEEE & RoHS Directives that define standards for recycling
and reuse of Waste Electrical and Electronic Equipment and for the Restriction of the use of
certain Hazardous Substances. From July 1, 2006, the RoHS Directive will prohibit any
marketing of new products containing the restricted substances.
Increasing attention is given to issues related to the global environmental. Toshiba Corporation
recognizes environmental protection as a key management tasks, and is doing its utmost to
enhance and improve the quality and scope of its environmental activities. In line with this,
Toshiba proactively promotes Green Procurement, and seeks to purchase and use products,
parts and materials that have low environmental impacts.
Green procurement of parts is not only confined to manufacture. The same green parts used in
manufacture must also be used as replacement parts.
(*2) LEAD-FREE
SOLDER
This product is manufactured using lead-free solder as a part of a movement within the consumer
products industry at large to be environmentally responsible. Lead-free solder must be used in the
servicing and repair of this product.
WARNING
This product is manufactured using lead free solder.
DO NOT USE LEAD BASED SOLDER TO REPAIR THIS PRODUCT !
The melting temperature of lead-free solder is higher than that of leaded solder by 86°F to 104°F
(30°C to 40°C). Use of a soldering iron designed for lead-based solders to repair product made
with lead-free solder may result in damage to the component and or BOARD being soldered.
Great care should be made to ensure high-quality soldering when servicing this product —
especially when soldering large components, through-hole pins, and on BOARDs — as the level
of heat required to melt lead-free solder is high.
Summary of Contents for DVR19DTKB2
Page 4: ...1 1 1 E9TK3SP SPECIFICATIONS ...
Page 58: ...1 14 3 NOTE BOARD MEANS PRINTED CIRCUIT BOARD E9TK3SCAV1 AV 1 9 Schematic Diagram VCR Section ...
Page 60: ...1 14 5 NOTE BOARD MEANS PRINTED CIRCUIT BOARD E9TK3SCAV3 AV 3 9 Schematic Diagram VCR Section ...
Page 61: ...1 14 6 NOTE BOARD MEANS PRINTED CIRCUIT BOARD E9TK3SCAV4 AV 4 9 Schematic Diagram VCR Section ...
Page 62: ...1 14 7 NOTE BOARD MEANS PRINTED CIRCUIT BOARD E9TK3SCAV5 AV 5 9 Schematic Diagram VCR Section ...
Page 63: ...1 14 8 NOTE BOARD MEANS PRINTED CIRCUIT BOARD E9TK3SCAV6 AV 6 9 Schematic Diagram VCR Section ...
Page 64: ...1 14 9 NOTE BOARD MEANS PRINTED CIRCUIT BOARD E9TK3SCAV7 AV 7 9 Schematic Diagram VCR Section ...
Page 89: ...1 17 3 DVDP_TI Push close 0 08 V 0 02 s Push Close detection Threshold level ...
Page 97: ...1 20 4 E9TK3PEX Packing X 2 X 3 X 6 X1 Upper Side Lower Side FRONT ...
Page 123: ......