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SN74LVC2G241

SCES210O – APRIL 1999 – REVISED DECEMBER 2015

www.ti.com

12 Device and Documentation Support

12.1 Documentation Support

12.1.1 Related Documentation

For related documentation, see the following:

Implications of Slow or Floating CMOS Inputs

,

SCBA004

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's

Terms of

Use

.

TI E2E™ Online Community

TI's Engineer-to-Engineer (E2E) Community.

Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.

Design Support

TI's Design Support

Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

12.3 Trademarks

NanoFree, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022

TI Glossary

.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser based versions of this data sheet, refer to the left hand navigation.

12

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Copyright © 1999–2015, Texas Instruments Incorporated

Product Folder Links:

SN74LVC2G241

Summary of Contents for SN74LVC2G241

Page 1: ...anslate To ensure the high impedance state during power up Inputs From a Max of 5 5 V Down or power down OE should be tied to VCC through a to the VCC Level pullup resistor and OE should be tied to GN...

Page 2: ...cs 7 12 4 Electrostatic Discharge Caution 12 6 9 Typical Characteristic 7 12 5 Glossary 12 7 Parameter Measurement Information 8 13 Mechanical Packaging and Orderable 8 Detailed Description 9 Informat...

Page 3: ...VSSOP Top View Top View YZP Package 8 Pin DSBGA Bottom View Pin Functions 1 2 PIN I O DESCRIPTION NAME NO 1A 2 I Input 1OE 1 I Output enable Active low 1Y 6 O Output 2A 5 I Input 2Y 3 O Output 2OE 7...

Page 4: ...3 The value of VCC is provided in the Recommended Operating Conditions table 6 2 ESD Ratings VALUE UNIT Human body model HBM per ANSI ESDA JEDEC JS 001 all pins 1 2000 Electrostatic V ESD V Charged d...

Page 5: ...mmended operating free air temperature range TA 40 C to 125 C unless otherwise noted PARAMETER TEST CONDITIONS VCC TA MIN TYP 1 MAX UNIT IOH 100 A 1 65 V to 5 5 V VCC 0 1 IOH 4 mA 1 65 V 1 2 IOH 8 mA...

Page 6: ...2 5 V 0 2 V 1 5 2 tdis OE Y ns VCC 3 3 V 0 3 V 1 4 2 VCC 5 V 0 5 V 1 3 3 6 7 Switching Characteristics TA 40 C to 125 C over recommended operating free air temperature range unless otherwise noted se...

Page 7: ...T CONDITIONS VCC TYP UNIT VCC 1 8 V 19 VCC 2 5 V 19 Outputs enabled pF VCC 3 3 V 20 Power dissipation VCC 5 V 22 Cpd capacitance f 10 MHz VCC 1 8 V 2 per buffer driver VCC 2 5 V 2 Outputs disabled pF...

Page 8: ...ons such that the output is low except when disabled by the output control Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control...

Page 9: ...Figure 3 Logic Diagram Positive Logic 8 3 Feature Description To ensure the high impedance state during power up or power down OE should be tied to VCC through a pullup resistor and OE should be tied...

Page 10: ...plication Figure 4 SN74LVC2G241 Application 9 2 1 Design Requirements This device uses CMOS technology and has balanced output drive Take care to avoid bus contention because it can drive currents tha...

Page 11: ...bypass capacitor should be installed as close to the power pin as possible for best results 11 Layout 11 1 Layout Guidelines When using multiple bit logic devices inputs must not ever float In many c...

Page 12: ...ign support tools and contact information for technical support 12 3 Trademarks NanoFree E2E are trademarks of Texas Instruments All other trademarks are the property of their respective owners 12 4 E...

Page 13: ...ct NRND Not recommended for new designs Device is in production to support existing customers but TI does not recommend using this part in a new design PREVIEW Device has been announced but is not in...

Page 14: ...th Important Information and Disclaimer The information provided on this page represents TI s knowledge and belief as of the date that it is provided TI bases its knowledge and belief on information p...

Page 15: ...n1 Quadrant 74LVC2G241DCUTG4 VSSOP DCU 8 250 180 0 8 4 2 25 3 35 1 05 4 0 8 0 Q3 SN74LVC2G241DCTR SM8 DCT 8 3000 180 0 13 0 3 35 4 5 1 55 4 0 12 0 Q3 SN74LVC2G241DCUR VSSOP DCU 8 3000 180 0 8 4 2 25 3...

Page 16: ...mm Height mm 74LVC2G241DCUTG4 VSSOP DCU 8 250 202 0 201 0 28 0 SN74LVC2G241DCTR SM8 DCT 8 3000 182 0 182 0 20 0 SN74LVC2G241DCUR VSSOP DCU 8 3000 202 0 201 0 28 0 SN74LVC2G241YZPR DSBGA YZP 8 3000 21...

Page 17: ...0 8 0 15 NOM Gage Plane 4188781 C 09 02 4 25 5 0 30 0 15 2 90 3 75 2 70 8 4 3 15 2 75 1 0 10 0 00 1 30 MAX Seating Plane 0 10 M 0 13 0 65 PIN 1 INDEX AREA NOTES A All linear dimensions are in millime...

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Page 19: ...GRID ARRAY NOTES 1 All linear dimensions are in millimeters Any dimensions in parenthesis are for reference only Dimensioning and tolerancing per ASME Y14 5M 2 This drawing is subject to change withou...

Page 20: ...continued 3 Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints For more information see Texas Instruments literature number SNVA009 www ti com lit sn...

Page 21: ...P 4223082 A 07 2016 DSBGA 0 5 mm max height YZP0008 DIE SIZE BALL GRID ARRAY NOTES continued 4 Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release SYMM SY...

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Page 24: ...TI Resource NO OTHER LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD...

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