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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES

1.

Delivery:

TI delivers TI evaluation boards, kits, or modules, including demonstration software, components, and/or documentation

which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms
and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions.

1.1

EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software

1.2

EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.

2

Limited Warranty and Related Remedies/Disclaimers

:

2.1

These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.

2.2

TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.

2.3

If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.

3

Regulatory Notices:

3.1

United States

3.1.1

Notice applicable to EVMs not FCC-Approved:

This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.

3.1.2

For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTION

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.

Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.

FCC Interference Statement for Class A EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.

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Summary of Contents for LaunchPad MSP-EXP430FR5994

Page 1: ...ademarks are the property of their respective owners User s Guide SLAU678A March 2016 Revised April 2016 MSP430FR5994 LaunchPad Development Kit MSP EXP430FR5994 The MSP EXP430FR5994 LaunchPad development kit is an easy to use evaluation module EVM for the MSP430FR5994 microcontroller MCU It contains everything needed to start developing on the ultra low power MSP430FRx FRAM microcontroller platfor...

Page 2: ...SP EXP430FR5994 Super Cap Power Block Diagram 13 10 BoosterPack Plug in Module Checker Tool 15 11 LaunchPad Development Kit to BoosterPack Plug in Module Connector Pinout 16 12 MSP EXP430FR5994 Out of Box Demo GUI 18 13 Live Temperature Mode 19 14 FRAM Log Mode 20 15 Record 22 16 Playback 23 17 Alternate Microphone Configuration 24 18 EEPROM SPI Interface Block Diagram 25 19 EEPROM I2 C Interface ...

Page 3: ...family that is designed for fast efficient and low power vector math and more plenty to get you started in your development Rapid prototyping is simplified by the 40 pin BoosterPack plug in module headers which support a wide range of available BoosterPack modules Quickly add features like wireless connectivity graphical displays environmental sensing and much more Design your own BoosterPack plug...

Page 4: ... voltage values After reconnecting to the GUI these values can be uploaded and graphed in the GUI 1 4 2 3 SD Card Data Log Mode This mode shows the data logging capabilities of the MSP430FR5994 while interfacing with an SD card After starting this mode the LaunchPad development kit wakes up every five seconds from sleep mode indicated by LED blink to log both temperature and input voltage values A...

Page 5: ...d April 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated MSP430FR5994 LaunchPad Development Kit MSP EXP430FR5994 2 Hardware Figure 2 shows an overview of the MSP EXP430FR5994 hardware Figure 2 MSP EXP430FR5994 Overview ...

Page 6: ...e block diagram Figure 3 MSP EXP430FR5994 Block Diagram 2 2 Hardware Features 2 2 1 MSP430FR5994 MCU The MSP430FR5994 is the next device in TI s new ULP FRAM technology platform FRAM is a cutting edge memory technology that combines the best features of flash and RAM into one nonvolatile memory For more information on FRAM see www ti com fram Device features include 1 8 V to 3 6 V operation 16 bit...

Page 7: ...4 TB0 3 SMCLK P3 5 TB0 4 COUT P3 6 TB0 5 P3 7 TB0 6 P1 6 TB0 3 UCB0SIMO UCB0SDA TA0 0 P1 7 TB0 4 UCB0SOMI UCB0SCL TA1 0 P4 4 TB0 5 P4 5 P4 6 DVSS1 P2 7 P2 3 TA0 0 UCA1STE A6 C10 AVSS3 PJ 6 HFXIN PJ 7 HFXOUT AVSS2 PJ 4 LFXIN PJ 5 LFXOUT AVSS1 AVCC1 P2 4 TA1 0 UCA1CLK A7 C11 DVSS2 P5 1 UCB1SOMI UCB1SCL P5 2 UCB1CLK TA4CLK P5 3 UCB1STE P5 4 UCA2TXD UCA2SIMO TB0OUTH P5 5 UCA2RXD UCA2SOMI ACLK P5 6 UCA...

Page 8: ...olio see Table 1 Table 1 EnergyTrace Technology Features EnergyTrace Technology EnergyTrace Technology Current Monitoring CPU State Peripheral and System State Devices Supported All MSP430 MCUs FR59 and FR69 MCUs Development Tool Required MSP FET or eZ FET MSP FET or eZ FET In Figure 5 the dotted line through J101 divides the eZ FET debug probe from the target area The signals that cross this line...

Page 9: ...ol 3 V and 5 V power flow between the eZ FET and target domains To expose the target MCU pins for other use than onboard debugging and application UART communication To expose the programming and UART interface of the eZ FET so that it can be used for devices other than the onboard MCU Table 2 Isolation Block Connections Jumper Description GND Ground 5V 5 V VBUS from USB 3V3 3 3 V rail derived fro...

Page 10: ...des a communication channel to the PC host side This can be used to create graphical user interfaces GUIs and other programs on the PC that communicate with the LaunchPad development kit Figure 6 shows the pathway of the backchannel UART The backchannel UART is the UART on eUSCI_A0 This UART channel is separate from the UART on the 40 pin BoosterPack plug in module connector eUSCI_A3 On the host s...

Page 11: ...rd is inserted while the MSP430FR5994 is on an interrupt for the MCU is generated Table 3 lists the SD Card Detect pin and the rest of the pin assignments that are used to communicate with the SD card Table 3 microSD Card to MSP Connections microSD Card Function MSP430FR5994 Pin SD Card Detect P7 2 SD SPI MOSI P1 6 SD SPI MISO P1 7 SD SPI CS P4 0 SD SPI CLK P2 2 R7 on the MSP430FR5994 LaunchPad de...

Page 12: ...ly scenario is from USB through the eZ FET debugger This provides 5 V power from the USB and also regulates this power rail to 3 3 V for eZ FET operation and 3 3 V to the target side of the LaunchPad development kit Power from the eZ FET is controlled by jumper J101 For 3 3 V make sure that a jumper is connected across the J101 3V3 terminal 2 3 2 BoosterPack Plug in Module and External Power Suppl...

Page 13: ...t be coming from the eZ FET debug probe external power through J5 or a BoosterPack plug in module powering through J1 Allow two to three minutes for the super cap to charge time may vary depending on initial charge of the super cap and the power source to full VCC 2 3 3 2 Using the Super Cap After charging of the super cap move the J8 jumper to the Use setting and unplug power This connects the su...

Page 14: ...n CCS and IAR EnergyTrace allows you to compare various current profiles and better optimize the energy performance 2 5 Clocking The MSP EXP430FR5994 provides external clocks in addition to the internal clocks in the device Q1 32 kHz Epson crystal FC 135R Q2 DNP high frequency crystal footprint The 32 kHz crystal allows for lower LPM3 sleep currents than do the other low frequency clock sources Th...

Page 15: ... pin LaunchPad development kits While most BoosterPack plug in modules are compliant with the standard some are not The MSP EXP430FR5994 LaunchPad development kit is compatible with all 40 pin BoosterPack plug in module that comply with the standard If the reseller or owner of the BoosterPack plug in module does not explicitly indicate compatibility with the MSP EXP430FR5994 LaunchPad development ...

Page 16: ...ent Kit to BoosterPack Plug in Module Connector Pinout 2 8 Design Files 2 8 1 Hardware See Section 6 for schematics All design files including schematics layout bill of materials BOM Gerber files and documentation are available on the MSP EXP430FR5994 Design File Download Page 2 8 2 Software All design files including TI TXT object code firmware images software example projects and documentation a...

Page 17: ...orts the MSP430FR5994 MCU Table 6 lists the minimum requirements for IDEs Table 6 IDE Minimum Requirements for MSP EXP430FR5994 Code Composer Studio IDE IAR Embedded Workbench IDE CCS v6 1 3 or later IAR Embedded Workbench for MSP430 v6 30 or later For more details on how to get started quickly and where to download the latest CCS and IAR IDEs see Section 4 3 1 Out of Box Software Example This sec...

Page 18: ...t Serial COM Port MSP Application UART1 and clicking the Open button On Windows open Device Manager Ports COM LPT to verify the corresponding COM port of the backchannel UART After connection has been established the GUI pings the LaunchPad development kit every few seconds to make sure that it is still present and to keep the serial port open If no response is received from the LaunchPad developm...

Page 19: ...hrough the UART backchannel to the PC GUI As the raw ADC data is received by the PC GUI Celsius and Fahrenheit units are calculated first The PC GUI keeps a buffer of the most recent 100 temperature measurements which are graphed against the current time of the PC on the Incoming Data panel A red horizontal line is drawn across the data plot to indicate the moving average of the incoming data To e...

Page 20: ... Super Cap the 12 bit ADC is set up to sample and convert the signals from its internal temperature sensor and battery monitor super cap voltage The board allows powering the application with the USB cable or the onboard super cap See Section 2 3 3 for more detail on the super cap To switch to the super cap 1 While board is powered through USB configure the jumper to Charge on J8 Wait 2 to 3 minut...

Page 21: ...Card Data to transfer the data from the most recently created LOG_ TXT to the PC NOTE The super cap cannot power the SDCard Log Mode for long periods of time because the SDCard consumes significantly more power 3 2 Blink LED Example This simple software example demonstrates how to software toggle a GPIO to blink an LED on the LaunchPad kit 3 2 1 Source File Structure The project is split into mult...

Page 22: ...f the onboard SPI DAC application global h Global variables definitions Library driverlib Device driver library 3 3 2 Operation This demo uses the built in ADC12 on the MSP430FR5994 MCU to sample from the output of the analog microphone on the Audio Signal Processing BoosterPack plug in module Using direct memory access DMA the 12 bit microphone data is stored and retrieved from FRAM memory During...

Page 23: ...main c The demo s clock GPIO display and interrupt configurations application application c Main application loop and interrupt service routines application audio_collect c Setup start stop and shutdown audio collect functions application audio_playback c Setup start and stop playback functions and interrupt service routines application dac8311 c Operating modes functions of the onboard SPI DAC ap...

Page 24: ...his example please visit the TI Design page at http www ti com tool tidm filtering signalprocessing Figure 17 Alternate Microphone Configuration 3 5 Emulating EEPROM TI Design Example This section describes the functionality and structure of the Emulating EEPROM TI Design Its software can be downloaded from TIDM FRAM EEPROM Software 3 5 1 Source File Structure The project is split into multiple fi...

Page 25: ...e SPI operation also includes DMA Figure 18 EEPROM SPI Interface Block Diagram Figure 19 EEPROM I2 C Interface Block Diagram This TI Design also emulates industry standard EEPROM protocols such as I2 C and SPI as well as a write protection pin to ensure that the device is protected from any writes On top of EEPROM emulation the TI Design periodically samples the ADC for the latest VCC and temperat...

Page 26: ... more about TI Resource Explorer Cloud now at dev ti com Figure 20 TI Resource Explorer Cloud 4 1 1 2 Code Composer Studio Cloud Code Composer Studio Cloud CCS Cloud is a web based IDE that enables you to quickly create edit build and debug applications for your LaunchPad development kit see Figure 21 No need to download and install large software packages simply connect your LaunchPad development...

Page 27: ...roller and Embedded Processors portfolio Code Composer Studio comprises a suite of tools used to develop and debug embedded applications It includes an optimizing C C compiler source code editor project build environment debugger profiler and many other features Learn more about CCS and download it at http www ti com tool ccstudio CCS v6 1 3 or higher is required When CCS has been launched and a w...

Page 28: ... there When you click OK CCS should recognize the project and allow you to import it The indication that CCS has found it is that the project appears in the box shown in 19 and it has a checkmark to the left of it Figure 23 When CCS Has Found the Project Sometimes CCS finds the project but does not show a checkmark This might mean that the workspace already has a project by that name Resolve this ...

Page 29: ...y default these are already included in a CCS installation 4 2 LaunchPad Websites For more information about the LaunchPad development kit supported BoosterPack plug in modules and available resources visit MSP EXP430FR5994 tool folder Resources specific to this particular LaunchPad development kit TI LaunchPad portal Information about all LaunchPad kits from TI 4 3 MSPWare and TI Resource Explore...

Page 30: ...h one click 4 4 FRAM Utilities The Texas Instruments FRAM Utilities is a collection of embedded software utilities that leverage the ultra low power and virtually unlimited write endurance of FRAM The utilities are available for MSP430FRxx FRAM microcontrollers and provide example code to help start application development 4 4 1 Compute Through Power Loss CTPL CTPL is a utility API set that enable...

Page 31: ...ametric information for this device 4 5 2 MSP430FR5994 Code Examples MSP430FR599x MSP430FR596x Code Examples is a set of simple C examples that demonstrate how to use the entire set of MSP430 peripherals including serial communication ADC12 LCD_C Timer_A Timer_B and others through direct register access Every MSP derivative has a set of these code examples When starting a new project or adding a n...

Page 32: ...RXD and send data from the host If you don t see data it might be a problem on the host side Probe on TXD while sending data from the MSP If you don t see data it might be a configuration problem with the eUSCI module Consider the use of the hardware flow control lines especially for higher baud rates Q The MSP G2 LaunchPad had a socket allowing me change the target device Why doesn t this LaunchP...

Page 33: ...rated www ti com Schematics 33 SLAU678A March 2016 Revised April 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated MSP430FR5994 LaunchPad Development Kit MSP EXP430FR5994 6 Schematics Figure 25 Schematics 1 of 7 ...

Page 34: ...ncorporated Schematics www ti com 34 SLAU678A March 2016 Revised April 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated MSP430FR5994 LaunchPad Development Kit MSP EXP430FR5994 Figure 26 Schematics 2 of 7 ...

Page 35: ...ncorporated www ti com Schematics 35 SLAU678A March 2016 Revised April 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated MSP430FR5994 LaunchPad Development Kit MSP EXP430FR5994 Figure 27 Schematics 3 of 7 ...

Page 36: ...ncorporated Schematics www ti com 36 SLAU678A March 2016 Revised April 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated MSP430FR5994 LaunchPad Development Kit MSP EXP430FR5994 Figure 28 Schematics 4 of 7 ...

Page 37: ...ncorporated www ti com Schematics 37 SLAU678A March 2016 Revised April 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated MSP430FR5994 LaunchPad Development Kit MSP EXP430FR5994 Figure 29 Schematics 5 of 7 ...

Page 38: ...ncorporated Schematics www ti com 38 SLAU678A March 2016 Revised April 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated MSP430FR5994 LaunchPad Development Kit MSP EXP430FR5994 Figure 30 Schematics 6 of 7 ...

Page 39: ...ncorporated www ti com Schematics 39 SLAU678A March 2016 Revised April 2016 Submit Documentation Feedback Copyright 2016 Texas Instruments Incorporated MSP430FR5994 LaunchPad Development Kit MSP EXP430FR5994 Figure 31 Schematics 7 of 7 ...

Page 40: ...tory NOTE Page numbers for previous revisions may differ from page numbers in the current version Changes from March 31 2016 to April 26 2016 Page Changed the text and links in the first paragraph in Section 3 4 Filtering and Signal Processing With LEA TI Design Example 23 Changed the text and links in the first paragraph in Section 3 5 Emulating EEPROM TI Design Example 24 ...

Page 41: ... are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty If TI elects to repair or replace such EVM TI shall have a reasonable time to repair such EVM or provide replacements Repaired EVMs shall be warranted for the remainder of the original warranty period Replaced EVMs shall be warranted for a new full ninety 90 day wa...

Page 42: ... by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated Antenna types not included in this list having a gain greater than the maximum gain indicated for that type are strictly prohibited for use with this device Concernant les EVMs avec antennes détachables Conformément à la rég...

Page 43: ...connecting any load to the EVM output If there is uncertainty as to the load specification please contact a TI field representative During normal operation even with the inputs and outputs kept within the specified allowable ranges some circuit components may have elevated case temperatures These components include but are not limited to linear regulators switching transistors pass transistors cur...

Page 44: ...F REMOVAL OR REINSTALLATION ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES RETESTING OUTSIDE COMPUTER TIME LABOR COSTS LOSS OF GOODWILL LOSS OF PROFITS LOSS OF SAVINGS LOSS OF USE LOSS OF DATA OR BUSINESS INTERRUPTION NO CLAIM SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED 8 2 Specific Limitations IN NO EVENT SHALL T...

Page 45: ...esponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided by TI Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failur...

Page 46: ...Mouser Electronics Authorized Distributor Click to View Pricing Inventory Delivery Lifecycle Information Texas Instruments MSP EXP430FR5994 ...

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