ZE60-2.4 RF module User Guide
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 31 of 45
1vv0300844
Rev.2 – 24/08/2010
The barcode label located on the module shield is able to withstand the reflow temperature.
CAUTION
It must also be noted that if the host board is submitted to a wave
soldering after the reflow operation, a solder mask must be used in
order to protect the tiny radio module’s metal shield from being in
contact with the solder wave.