ZE60-2.4 RF module User Guide
Reproduction forbidden without Telit Communications S.p.A. written authorization - All Rights Reserved
page 4 of 45
1vv0300844
Rev.2 – 24/08/2010
CONTENTS
CHAPTER I. INTRODUCTION................................................................................................................... 6
I.1.
A
IM OF THE
D
OCUMENT
.................................................................................................................................................................................... 6
I.2.
R
EFERENCE DOCUMENTS
................................................................................................................................................................................. 7
I.3.
D
OCUMENT CHANGE LOG
................................................................................................................................................................................. 7
I.4.
G
LOSSARY
...................................................................................................................................................................................................... 8
CHAPTER II. REQUIREMENTS ................................................................................................................ 9
II.1.
R
EGULATIONS REQUIREMENTS
........................................................................................................................................................................ 9
II.2.
F
UNCTIONAL
R
EQUIREMENTS
........................................................................................................................................................................ 12
II.3.
S
OFTWARE
.................................................................................................................................................................................................. 12
II.4.
T
EMPERATURE
R
EQUIREMENTS
.................................................................................................................................................................... 13
CHAPTER III. GENERAL CHARACTERISTICS ...................................................................................... 14
III.1.
M
ECHANICAL
C
HARACTERISTICS
................................................................................................................................................................. 14
III.2.
M
ECHANICAL DIMENSIONS
........................................................................................................................................................................... 15
III.3.
DC
C
HARACTERISTICS
................................................................................................................................................................................ 16
III.4.
F
UNCTIONAL CHARACTERISTICS
.................................................................................................................................................................. 17
III.5.
D
IGITAL
C
HARACTERISTICS
......................................................................................................................................................................... 19
III.6.
A
BSOLUTE
M
AXIMUM
R
ATINGS
.................................................................................................................................................................... 19
III.7.
O
RDERING INFORMATION
............................................................................................................................................................................ 20
CHAPTER IV. TECHNICAL DESCRIPTION ............................................................................................ 21
IV.1.
P
IN
-
OUT OF THE
SMD
M
ODULE
.................................................................................................................................................................... 21
IV.2.
P
IN
-
OUT OF THE
DIP
M
ODULE
...................................................................................................................................................................... 23
IV.3.
C
ORRESPONDENCE
..................................................................................................................................................................................... 24
IV.4.
D
ESCRIPTION OF THE
S
IGNALS
..................................................................................................................................................................... 25
CHAPTER V. PROCESS INFORMATION ............................................................................................... 26
V.1.
D
ELIVERY
..................................................................................................................................................................................................... 26
V.2.
S
TORAGE
..................................................................................................................................................................................................... 27
V.3.
S
OLDERING PAD PATTERN
............................................................................................................................................................................. 27
V.4.
S
OLDER PASTE COMPOSITION
(R
O
HS
PROCESS
) ........................................................................................................................................... 29
V.5.
P
LACEMENT
.................................................................................................................................................................................................. 29
V.6.
S
OLDERING PROFILE
(R
O
HS
PROCESS
)......................................................................................................................................................... 30
CHAPTER VI. BOARD MOUNTING RECOMMENDATION..................................................................... 32
VI.1.
E
LECTRICAL ENVIRONMENT
.......................................................................................................................................................................... 32
VI.2.
P
OWER SUPPLY DECOUPLING ON
ZE60-2.4
MODULE
.................................................................................................................................... 33
