![Telit Wireless Solutions NL865H2 Series Hardware Design Manual Download Page 54](http://html1.mh-extra.com/html/telit-wireless-solutions/nl865h2-series/nl865h2-series_hardware-design-manual_1083719054.webp)
NL865H2 Hardware Design Guide
1VV0301616 Rev. 7
Page
54
of
67
2020-04-20
Solder paste
Item
Lead Free
Solder Paste
Sn/Ag/Cu
We recommend using only “no clean” solder paste in order to avoid the cleaning of the
modules after assembly.
Solder Reflow
Recommended solder reflow profile:
Warning:
The above solder reflow profile represents the typical SAC reflow limits
and does not guarantee adequate adherence of the module to the
customer application throughout the temperature range. Customer
must optimize the reflow profile depending on the overall system taking
into account such factors as thermal mass and warpage