NL865H2 Hardware Design Guide
1VV0301616 Rev. 7
Page
53
of
67
2020-04-20
Holes in pad are allowed only for blind holes and not for through holes.
Recommendations for PCB pad surfaces:
Finish
Layer thickness [µm]
Properties
Electro-less Ni /
Immersion Au
3
–7 / 0.03 – 0.15
good solder ability protection
The PCB must be able to resist the higher temperatures which are occurring at the lead-
free process. This issue should be discussed with the PCB-supplier. Generally, the
wettability of tin-lead solder paste on the described surface plating is better compared to
lead-free solder paste.
It is not necessary to panel the application PCB, however in that case it is suggested to use
milled contours and predrilled board breakouts; scoring or v-cut solutions are not
recommended.
Stencil
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we
suggest a thickness of stencil foil ≥ 120 µm.
