NL865H2 Hardware Design Guide
1VV0301616 Rev. 7
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2020-04-20
4.4.2.
Thermal Design Guidelines
The thermal design for the power supply heat sink should be done considering the values
described in the “Power Consumption” chapter.
Considering the very low current during idle, especially if Power Saving function is
enabled, it is possible to consider from the thermal point of view that the device absorbs
current significantly only during calls.
For the heat generated by the module, you can consider it to be during transmission
0.99W max during Data call.
This generated heat will be mostly conducted to the ground plane under the module; you
must ensure that your application can dissipate it.
NOTE:
The average consumption during transmissions depends on the
power level at which the device is requested to transmit by the
network. The average current consumption hence varies significantly.
