GL865-DUAL V3 Hardware User Guide
1vv0301018 Rev.5 – 2013-08-05
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
Page 7 of 76
Mod. 0805 2011-07 Rev.2
11.11.
RTC Bypass out
........................................................................................................ 57
11.12.
SIM Holder Implementation
...................................................................................... 57
12.
DAC and ADC section
......................................................................................... 58
12.1.
DAC Converter
......................................................................................................... 58
12.1.1.
Description
...................................................................................................................... 58
12.1.2.
Enabling DAC
.................................................................................................................. 59
12.1.3.
Low Pass Filter Example
................................................................................................... 59
12.2.
ADC Converter
......................................................................................................... 60
12.2.1.
Description
...................................................................................................................... 60
12.2.2.
Using ADC Converter
....................................................................................................... 60
13.
Mounting the GL865-DUAL V3 on your Board
...................................................... 61
13.1.
General
..................................................................................................................... 61
13.2.
Module finishing & dimensions
................................................................................. 61
13.3.
Recommended foot print for the application
............................................................... 62
13.4.
Stencil
...................................................................................................................... 62
13.5.
PCB pad design
........................................................................................................ 63
13.6.
Recommendations for PCB pad dimensions (mm):
..................................................... 63
13.7.
Solder paste
.............................................................................................................. 65
13.8.
GL865-DUAL V3 Solder reflow
................................................................................ 65
13.9.
Debug of the GL865-DUAL V3 in production
............................................................ 66
14.
Packing system
................................................................................................... 67
14.1.
Packing on tray
......................................................................................................... 67
14.2.
Packing on reel
......................................................................................................... 69
14.2.1.
Carrier tape detail
............................................................................................................. 70
14.2.2.
Carrier tape detail
............................................................................................................. 70
14.3.
Moisture sensibility
................................................................................................... 71
15.
Conformity Assessment Issues
.............................................................................. 72
16.
Safety Recommendations
..................................................................................... 75
17.
Document History
............................................................................................... 76