GL865-DUAL V3 Hardware User Guide
1vv0301018 Rev.5 – 2013-08-05
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved.
Page 66 of 76
Mod. 0805 2011-07 Rev.2
Profile Feature
Pb-Free Assembly
Average ramp-up rate (TL to TP)
3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp)
245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate
6°C/second max.
Time 25°C to Peak Temperature (ttp)
8 minutes max.
NOTE:
All temperatures refer to topside of the package, measured on the package body
surface
WARNING:
The GL865-DUAL V3 module withstands one reflow process only.
13.9.
Debug of the GL865-DUAL V3 in production
To test and debug the mounting of the GL865-DUAL V3, we strongly recommend foreseeing
test pads on the host PCB, in order to check the connection between the GL865-DUAL V3
itself and the application and to test the performance of the module connecting it with an
external computer. Depending by the customer application, these pads include, but are not
limited to the following signals:
•
TXD
•
RXD
•
ON/OFF*
•
HW SHUTDOWN*
•
GND
•
VBATT
•
TX_AUX
•
RX_AUX
•
PWRMON