
GL865-DUAL V3 Hardware User Guide
1vv0301018 Rev.5 – 2013-08-05
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Page 63 of 76
Mod. 0805 2011-07 Rev.2
Stencil’s apertures layout can be the same of the recommended footprint (1:1), we suggest a
thickness of stencil foil ≥ 120µm.
13.5.
PCB pad design
Non solder mask defined (NSMD) type is recommended for the solder pads on the PCB.
13.6.
Recommendations for PCB pad dimensions (mm):
PCB
Copper Pad
Solder Mask
SMD
(Solder Mask Defined)
NSMD
(Non Solder Mask Defined)
Solder resist opening