Telink FR1 PCB Design Guideline
AN-22051900-E1 Ver. 1.0.0
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4.
Layout Regulations
4.1
Package
The package forms of battery, LED, and MIC are shown in the figure below.
Figure 4-1 Package forms
4.2
Solder pads and via holes
The PCB package design of Telink IC is as shown in Figure 4-2.
The carbon film via hole is shown in Figure 4-3, the hole diameter is greater than 0.7mm, outer diameter
1.4mm. The air gap between carbon film hole and copper wire is 2.5mm or more.
