Getting Started
TMS 540 PowerPC 60X Microprocessor Support Instruction Manual
1–5
6. Check that the heat sink moves easily, and yet stays in position when not
being moved.
If the heat sink is very difficult to move or does not stay in position, you
need to adjust the friction of the O-ring in the PGA-to-QFP converter clip. To
adjust the friction, refer to Figure 1–1 and follow these steps:
a. If you have difficulty moving the heat sink, loosen each of the four
O-ring screws a little until the heat sink is moveable, and yet will stay in
position.
b. If the heat sink does not stay in position, tighten each of the four O-ring
screws a little until the heat sink is moveable, and yet will stay in
position.
CAUTION.
Do not loosen or tighten the four screws closest to the corners of the
PGA-to-QFP converter clip. These are set by the manufacturer.
Do not adjust
outside screws
O-ring
adjustment
screws
Figure 1–1: Adjusting the friction of the O-ring in the converter clip
7. Pull up the heat sink on the converter clip to allow vertical clearance for the
microprocessor.
8. Apply a small amount of thermal joint compound to the end of the heat sink
that faces the microprocessor (the end that will contact the microprocessor).