Step Technica MKY02, User Manual

Page: 71 / 73

Chapter 5 Ratings
5 - 9
5.4 Recommended Soldering Conditions
(1) Product storage conditions: T
A
= 40
°
C max., RH = 85% for prevention of moisture
absorption
(2) Manual soldering: Temperature of the tip of soldering iron 380
°
C, 5 s max.
(Device lead temperature 260
°
C, 10 s max., package surface temperature 150
°
C)
(3) Reflow: Twice max.
(4) Flux: Non-chlorine flux (should be cleaned sufficiently)
(5) Ultrasonic cleaning: Depending on frequencies and circuit board shapes, ultrasonic
cleaning may cause resonance, affecting lead strength
5.5 Recommended Reflow Conditions
The recommended conditions apply to hot-air reflow or infrared reflow. Temperature indi-
cates resin surface temperature of the package.
Parameter Symbol Reflow Manual soldering iron
Peak temperature (resin surface) Tp 255
°
C max. 380
°
C max.
Peak temperature holding time tp 10 s max. 5 s max.
Parameter Symbol Value
Pre-heat (time) t1 60 to 80/s
Pre-heat (temperature) T1 150 to 190 ° C
Temperature rise rate a 1 to 4 ° C/s
Peak condition (time) tp 10 s max.
Peak condition (temperature) Tp 255 ° C
Cooling rate b to 1.5 ° C/s
Cooling rate c to 0.5 ° C/s
High temperature area tw 220 ° C, 60 s max.
Removal temperature T2 ≤ 100 ° C