HT-CT380/CT381
HT-CT380/CT381
35
35
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
• Waveforms
– MAIN Board –
wa
Q802 (Base)
5 V/DIV, 5
P
s/DIV
8
P
s
12 Vp-p
1
IC3109
ud
(XTALOUT)
1 V/DIV, 20 ns/DIV
37.2 ns
3.8 Vp-p
2
IC3109
oa
(MCLK)
1 V/DIV, 50 ns/DIV
59 ns
4.6 Vp-p
7
IC2009
qd
(XTAL)
1 V/DIV, 20 ns/DIV
39.6 ns
3.7 Vp-p
20.8
P
s
4.3 Vp-p
9
IC2009
ya
(LRCLK_OUT)
1 V/DIV, 10
P
s/DIV
qa
IC1002
qa
(Xout)
1 V/DIV, 100 ns/DIV
126 ns
2.7 Vp-p
qd
IC1009
1
(BOOT)
5 V/DIV, 2
P
s/DIV
3
P
s
20.2 Vp-p
8
IC2009
y;
(BCK_OUT)
1 V/DIV, 200 ns/DIV
326 ns
4.4 Vp-p
3
IC2005
qk
(LRCK)
1 V/DIV, 10
P
s/DIV
20.8
P
s
4.1 Vp-p
4
IC2005
ql
(BCK)
1 V/DIV, 200 ns/DIV
326 ns
4.5 Vp-p
40.2 ns
3.7 Vp-p
5
IC2005
w;
(SCKO)
1 V/DIV, 20 ns/DIV
6
IC2005
r;
(XTO)
1 V/DIV, 20 ns/DIV
40.2 ns
2.8 Vp-p
q;
IC2012
1
(BST)
5 V/DIV, 2
P
s/DIV
3
P
s
24 Vp-p
qs
IC3705
1
(BOOT)
5 V/DIV, 2
P
s/DIV
2.9
P
s
24 Vp-p
– DISPLAY Board –
For Schematic Diagrams.
Note:
• All capacitors are in
μ
F unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in
Ω
and 1/4 W or less unless otherwise
speci
fi
ed.
•
f
: Internal component.
•
2
: Non
fl
ammable resistor.
•
5
: Fusible resistor.
•
C
: Panel designation.
•
A
: B+ Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : POWER ON
• Voltages are taken with VOM (Input impedance 10 M
).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
:
AUDIO
(ANALOG)
J
:
AUDIO
(DIGITAL)
E
:
VIDEO
N
:
Bluetooth
For Printed Wiring Boards.
Note:
•
X
: Parts extracted from the component side.
•
Y
: Parts extracted from the conductor side.
•
f
: Internal component.
•
: Pattern from the side which enables seeing.
(The other layers’ patterns are not indicated.)
Caution:
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• Indication of transistor.
C
B
These are omitted.
E
Q
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side)
Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
Note:
The components identi-
fi
ed by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number speci
fi
ed.
Note:
Les composants identi
fi
és
par une marque
0
sont
critiques pour la sécurité.
Ne les remplacer que par
une pièce portant le nu-
méro spéci
fi
é.
• MAIN board is multi-layer printed board. However, the
patterns of intermediate layers have not been included in
diagrams.
Note 1:
When the complete MAIN board is replaced, refer
to “NOTE OF REPLACING THE IC3001 ON THE
MAIN BOARD AND THE COMPLETE MAIN
BOARD” and “NOTES ON THE WIRELESS CON-
NECTION (LINK) AFTER REPAIRS ARE COM-
PLETE” on page 5.
Note 2:
When the complete POWER board is replaced, refer
to “BOND FIXATION OF ELECTRIC PARTS” on
page 6.
Note 1:
When the complete MAIN board is replaced, refer
to “NOTE OF REPLACING THE IC3001 ON THE
MAIN BOARD AND THE COMPLETE MAIN
BOARD” and “NOTES ON THE WIRELESS CON-
NECTION (LINK) AFTER REPAIRS ARE COM-
PLETE” on page 5.
Note 2:
When the complete POWER board is replaced, refer
to “BOND FIXATION OF ELECTRIC PARTS” on
page 6.
