1-6 (E)
HKC-7080
1-4-2. Modifying VA-158 Board
Parts Required
Description
Q’ty
Remarks
Modification board (with jumper wires)
1
Supplied with HKC-7080
Sony bond SC608LVZ
_
Sony Part No. 7-432-912-52
Res, metal chip 20 k
Z
3
Sony Part No. 1-218-723-91
Res, metal chip 51 k
Z
2
Sony Part No. 1-218-733-11
Modification Procedures
1.
Remove the VA-158 board.
2.
Solder the jumper wires from the modification board to the positions specified by the figure.
3.
Stick the modification board on the VA-158 board with Sony bond as shown in the figure.
(Shaded portions)
4.
Desolder the following five resistors.
R102, R104, CR106, R108, R109
5.
Solder 20 k
Z
metal film resistors at the traces of R102, R104, and R106.
6.
Solder 51 k
Z
metal film resistors at the traces of R108 and R109.
The HDC-700 with the following serial number needs the additional modification as follows.
HDC-700 (UCJ): Serial No.10001 to 10043
Description
Q’ty
Remarks
Res, metal chip 100 k
Z
1
Sony Part No. 1-218-740-11
Res, metal chip 150 k
Z
3
Sony Part No. 1-218-744-11
7.
Desolder the following four resistors.
R110, R300, R500, R700
8.
Solder an 100 k
Z
metal film resistor at the trace of R110.
9.
Solder 150 k
Z
metal film resistors at the traces of R300, R500, and R700.
1-4. Modifying Board
D
E
F
G
H
L
K
J
C
B
A
1
2
3
4
5
6
7
VA-158 (B SIDE)
C2
R8
R9 R5
R104
R102
R106
R110
R109
R108
R300
R500
R700
Summary of Contents for HKC-7080
Page 1: ...CCD MODIFICATION UNIT HKC 7080 INSTALLATION AND MAINTENANCE MANUAL 1st Edition Revised 1 ...
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Page 85: ...8 7 HKC 7080 8 7 DU 1 DU 1 DU 1 A SIDE SUFFIX 12 DU 1 B SIDE SUFFIX 12 ...
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