Sony DSX-M50BT, Service Manual

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DSX-M50BT
SECTION 7
ELECTRICAL PARTS LIST
A-1847-637-A BT BOARD, COMPLETE (Included in MAIN board)
(See Note 1)
******************
When the BT board is defective, exchange the complete mounted board.
*************************************************************
KEY BOARD
**********
When the KEY board is defective, exchange the FRONT PANEL ASSY (Ref. No. FP1).
*************************************************************
A-1981-910-A MAIN BOARD, COMPLETE (Including BT board)
(See Note 1, 2)
********************
7-685-134-19 SCREW +P 2.6X8 TYPE2 NON-SLIT
7-685-794-01 SCREW +PTT 2.6X10 (S)
< SURGE ABSORBER >
AB101 1-805-043-11 ABSORBER, CHIP SURGE
< CAPACITOR >
C101 1-114-329-11 CERAMIC CHIP 0.47uF 10% 50V
C102 1-114-329-11 CERAMIC CHIP 0.47uF 10% 50V
C105 1-128-992-21 ELECT CHIP 47uF 20% 25V
C106 1-100-588-21 ELECT CHIP 1000uF 20% 6.3V
C110 1-100-567-81 CERAMIC CHIP 0.01uF 10% 25V
C119 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C122 1-135-366-11 ELECT CHIP 100uF 20% 16V
C136 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C143 1-100-567-81 CERAMIC CHIP 0.01uF 10% 25V
C144 1-100-567-81 CERAMIC CHIP 0.01uF 10% 25V
C149 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
C150 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
C151 1-164-937-11 CERAMIC CHIP 0.001uF 10% 50V
C152 1-118-345-11 CERAMIC CHIP 0.01uF 10% 25V
C155 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C157 1-162-918-11 CERAMIC CHIP 18PF 5% 50V
C158 1-162-919-11 CERAMIC CHIP 22PF 5% 50V
*
C160 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V
C161 1-100-567-81 CERAMIC CHIP 0.01uF 10% 25V
C206 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C212 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C213 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C214 1-100-966-91 CERAMIC CHIP 10uF 20% 10V
C216 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C218 1-126-210-21 ELECT CHIP 220uF 20% 4V
C219 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C220 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C221 1-126-208-21 ELECT CHIP 47uF 20% 4V
C223 1-100-742-91 CERAMIC CHIP 2.2uF 20% 10V
C225 1-112-298-91 CERAMIC CHIP 1uF 10% 16V
C226 1-164-845-11 CERAMIC CHIP 5PF 0.25PF 50V
C227 1-164-845-11 CERAMIC CHIP 5PF 0.25PF 50V
C228 1-112-298-91 CERAMIC CHIP 1uF 10% 16V
C229 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C231 1-112-298-91 CERAMIC CHIP 1uF 10% 16V
C232 1-164-852-11 CERAMIC CHIP 12PF 5% 50V
C233 1-112-298-91 CERAMIC CHIP 1uF 10% 16V
* C234 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V
* C235 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V
C236 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C237 1-112-298-91 CERAMIC CHIP 1uF 10% 16V
C238 1-164-852-11 CERAMIC CHIP 12PF 5% 50V
C239 1-112-298-91 CERAMIC CHIP 1uF 10% 16V
C240 1-164-940-11 CERAMIC CHIP 0.0033uF 10% 16V
C241 1-164-882-11 CERAMIC CHIP 220PF 5% 16V
C244 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C245 1-165-492-21 ELECT CHIP 100uF 20% 10V
C250 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C252 1-100-567-81 CERAMIC CHIP 0.01uF 10% 25V
C255 1-112-781-11 CERAMIC CHIP 1uF 10% 10V
C256 1-100-966-91 CERAMIC CHIP 10uF 20% 10V
C259 1-100-909-11 CERAMIC CHIP 10uF 10% 6.3V
C260 1-118-290-11 CERAMIC CHIP 0.001uF 10% 50V
C261 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C263 1-125-777-11 CERAMIC CHIP 0.1uF 10% 10V
C264 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C265 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C266 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C267 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C268 1-164-866-11 CERAMIC CHIP 47PF 5% 50V
C269 1-162-923-11 CERAMIC CHIP 47PF 5% 50V
C274 1-162-923-11 CERAMIC CHIP 47PF 5% 50V
C275 1-162-923-11 CERAMIC CHIP 47PF 5% 50V
C276 1-162-923-11 CERAMIC CHIP 47PF 5% 50V
C277 1-162-923-11 CERAMIC CHIP 47PF 5% 50V
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
When indicating parts by reference num-
ber, please include the board name.
Note:
• Due to standardization, replacements in
the parts list may be different from the
parts speci
fi ed in the diagrams or the com-
ponents used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Items marked “ * ” are not stocked since
they are seldom required for routine ser-
vice. Some delay should be anticipated
when ordering these items.
• RESISTORS
All resistors are in ohms.
METAL:
Metal- fi lm resistor.
METAL OXIDE: Metal oxide- fi lm resistor.
F: non fl ammable
• CAPACITORS
uF:
μ
F
• COILS
uH:
μ
H
• SEMICONDUCTORS
In each case, u:
μ
, for example:
uA. . :
μ
A. . , uPA. . ,
μ
PA. . ,
uPB. . :
μ
PB. . , uPC. . ,
μ
PC. . ,
uPD. . :
μ
PD. .
Note 1: When the complete BT board or complete MAIN board is re-
placed, it is necessary to con
fi rm operation. Refer to “BLUE-
TOOTH FUNCTION CHECKING METHOD USING A CEL-
LULAR PHONE” on page 5.
Note 2: When the complete MAIN board is replaced, the destination
setting is necessary. Refer to “NOTE OF REPLACING THE
COMPLETE MAIN BOARD OR SYSTEM CONTROLLER
(IC101)” on page 4.
BT KEY MAIN