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HCD-GZR5D
HCD-GZR5D
58
58
7-27. PRINTED WIRING BOARDS – MIC/JACK Section–
•
: Uses unleaded solder.
• See page 36 for Circuit Boards Location.
1
A
B
C
D
E
F
G
H
I
2
3
4
5
6
7
8
9
10
11
12
13
GDS
ECB
ECB
BCE
BCE
BCE
BCE
BCE
BCE
W261
1
9
R261
RV261
MIC
LEVEL
J261
MIC
J251
AUDIO IN
PHONES
R262
R263
R264
R265
R267
R268
R269
R270
R271
R272
R273
R274
R276
R277
R278
R279
R280
R281
R282
R283
R284
R288
R289
LP261
JW201
JW202
JW203
JW204
JW205
JW206
JW208
JW209
C261
C262
C263
JW210
C264
C265
C267
C268
C269
C270
C271
C272
C273
C274
C275
(CHASSIS)
C276
C277
R890
C278
R891
C279
R892
R893
R894
R895
R896
R897
R898
C280
R899
C281
C282
C283
C284
C285
C286
C287
C288
C289
C290
C291
C292
C293
C294
C295
C296
C298
C299
D261
D262
D263
ET261
R900
R901
R902
R903
R904
R905
R906
R907
R908
R909
R910
R91
1
R912
R913
R914
R915
R916
J261
RV261
1
2
3
Q261
Q262
Q263
Q264
Q265
Q266
Q267
Q268
Q269
1
3
1
5
W251
W252
W253
C251
C252
C253
C254
C256
C257
J251
J252
MIC BOARD
JACK BOARD
11
(11)
1-876-006-
11
(11)
1-875-993-
D261
C-4
D262
C-5
D263
G-5
IC261
G-6
IC262
D-6
Q261
H-5
Q262
H-6
Q263
F-6
Q264
C-4
Q265
B-4
Q266
B-4
Q267
C-3
Q268
C-3
Q269
B-3
Ref. No. Location
• Semiconductor Location
Ref. No. Location
Summary of Contents for CDM74HF-DVBU101
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