S5PV210_HARDWARE DESING GUIDE REV 1.0
103
U34
SN74LVC1G04DBV
2
4
5
3
1
XuhDP
[2]
+
CTB64
10uF/10V
DN and DP should be routed evenly
R220
0
XuhDN
[2]
DC5V
XuhREXT
[2]
XuhOVERCUR
[2]
R226
0
DC5V
R222
NC
USB HOST
R273
100K
VDD_3V3
CON14
USB SINGLE Port - A Ty pe (Host)
1
2
3
4
5
6
VBUS
D-
D+
GND
G5
G6
R224
NC
R218
44.2/1%
U35
TPS2051BDBV
1
2
3
4
5
OUT
GND
nOC
EN
IN
XuhPWREN
[2]
Figure 14-1) USB Host circuit example
14.4. USB SIGNAL ROUTING
Introduction
This document conducts a guide to integrate a discrete high speed usb device onto a four layer PCB. The
board design guidelines handle trace separation, termination placement requirements and overall trace length
guidelines
PCB layout guidelines
Routing and placement
When an engineer lays out a new design, the excellent signal quality and minimized EMI problem must be
required. That is based on four layer board. The first layer is for signal layer. The second layer is for ground.
The third layer is for power and the fourth layer is for signal layer again. We should basically consider the
following instruction.
I.
HS signals should be placed on top shown in the below figure