Samsung DVD-807K, Service Manual

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Precautions
Samsung Electronics 2-3
-- Kind of the Part
The kind of the part is as follows:
1) Chip VRs.
2) Chip Trimmer Capacitors
3) Diode
4) Transistors
-- Removing the Part
1) Using two soldering irons:
Use small flat-blade tips.
Heat the leads of the part simultaneously.
When the solder melts, grasp and remove the part
with the soldering iron tips.
Remove the old solder with desoldering wire.
2-2-4 Diodes and Tr.
-- The kind of the Chip ICs
The kind of the chip ICs are as follows:
1) SOP(Small Outline Package)IC
2) SSOP(Shrink Small Outline Package)IC
3) VSOP(Very Small Outline Package)IC
4) QFP(Quad Flat Package)IC
5) VQFP(Very Quad Flat Package)IC
6) PLCC(Plastic Leaded Chip Carrier)IC
7) TSOP(Thin Small Outline Package)IC
2-2-5 Chip ICs
-- Removing the Part
1) Using special desoldering iron:
Selet the tip according to the size and shape of the IC.
“Tin” the tip with a small amount of the IC leads.
Set the tip squarely over the IC leads.
When the solder melts, carefully twist the iron.
Raise and remove the IC.
2) Using shaped airblower unit:
Select the correct nozzle.
Select the temperature and airblow(suggested:
temperature:7, airblow:4)
Engage the IC removing tool.
Use the airblow to preheat the IC for about 5
seconds, then heat with the nozzle until the IC
remover lifts the part from the board.
IC
Fig 2-4
-- Installing the Part
1) Use desoldering wire to remove the previous solder.
2) Clean the location.
3) Apply flux.
4) Position the IC and solder two pins at opposite sides.
5) Use a sharp tipped soldering iron and carefully sol
der each Pin.(After gaining experience, a thicker tip
can be used for better work efficiency.)
6) Remove any solder bridges with desoldering wire.
7) Inspect the work with a magnifier.
Fig 2-3
-- Installing the Part
1) Clean the area where the new part is to be mounted.
2) Apply flux.
3) Set part correctly into position, prevent it from shifting.
4) Use sharp soldering iron tip. Bring close to the
part contact without actually touching it. Melt thin
solder between the tip and part si that it flows into
the part contact.
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