Samsung AVXCSH023/032/040CE, Service Manual

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Product Specifications
2-2 Samsung Electronics
2) Vapor injection technology
Improved cooling and heating performance and COP by a new technology of two stage compression. As injecting optimized
mid-range pressure refrigerant, this technology achieved the high heating performance and COP under the lowest temperature,
which leads the industry.
• Increase refrigerant flow rates with a new vapor injection technology.
• Improved sub-cooling necessary for long piping installation while increasing cooling and heating performance and COP.
3) Turbo intercooler (RVXVH075/100/125FE, RD075/100/125VHXFA Only)
Turbo intercooler (Shell & tube type) improves cooling and heating COP and secures reliable operation of installation with long
piping [200m(656ft)].
Mo + Mi
Mi
Mo
More mass flow passing Indoor unit
increases heating capacity.
1st Expansion
Enthalpy (kJ/kg)
2nd
Expansion
Vapor injection reduces the liquid enthalpy in flash tank,
facilitating heat exchanger to absorb heat more.
Vapor injection
Injection
point
Mo
Mi
Mo + Mi
Evaporator (ID)
Condenser (OD)
DVI compressor
Vapor injection
Flash tank
Solenoid Valve
2nd
EEV
1st
EEV
†
Subcooling liquid refrigerant
ˆ
Low temperature gas
refrigerant
‡
Low temp. liquid
refrigerant
Saturated liquid
refrigerant
Temperature
High
Low
‡
ˆ
†
†
‡
ˆ
4) Plate type intercooler (RD075/100/125VRXFA Only)
The plate type intercooler is the new concept intercooler technology which is more advanced than the existing double layered
pipe type and Shell & Tube type heat exchanger. The plate type intercooler increases heat exchange efficiency by 30% and
provides stable performance with long piping and vertical piping.
EER Heat transfer efficiency
Efficiency Rate
Double layered pipe
Shell & Tube
Plate type
Structure Diagram
Plate type
Turbo
Inter-
Cooler
DVI
Compressor