Proc Sheet 1 15
myC-4
EQUIPPED ELECTRONIC BOARD EXCHANGE
1/3
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Ref. SCT U38 SSC DTS 0023 – Index B - February 21, 2005
Page 5-42
4.87 Preliminary operation
1. Control of the IMEI label integrity
2. Remove the equipped electronic board (
Proc sheet 1 03
)
3. Control of any oxidation marks (on the equipped electronic board and under the metal dome)
4.88 Return procedure :
(a) The equipped electronic boards are packaged in individual electrostatic envelopes
.
They must
be stocked in their original package of reception , to insure a good protection against external
attacks (see enclosed photos)
(b)
During the equipped electronic boards manipulation, gloves and electrostatic strap must be
worn at all times.
(c)
The defective equipped electronic boards have to be returned to SAGEM factory, packaged
individually, in the original package (see enclosed photos) , in the appropriate ESD box : One
box per Sagem reference (check reference written on the box).
(d)
The defective board should display the defect code written on a sticker (placed on the
shielding) and written on the ESD bag label too (printed with SMT).
Note :
−
On the defective boards , it is necessary to check visually under the metal dome to
discover if it shows oxidation marks. The defective boards should be returned with their
original metal dome
−
Boards with oxidation should not to set in conformance with the warranty
−
The defective boards must never be mixed with the complete mobiles
4.89 Placement procedure :
1. Take a board in the stock of swap boards from the same Sagem reference.
4.90 Further operations :
1. Place the new equipped electronic board on the assembly plate. .(
Proc sheet 1 03
)
2. Follow stages ( see enclosed photos)
