VC7 PCB Layout Guidelines Manual
R31UH0017EU0100 Rev.1.00
Aug 4, 2022
Page 8
4.3
RC21005A/RC21005AQ – 32-LGA
[5]
■
Device land pattern is shown below.
■
Stencil recommendations (Unit: mm)
●
Thickness: 0.125
●
Aperture for thermal pads: 0.60 × 0.55 (x4, each aperture vertex closes to the aggregate center of the
pattern. Four apertures should be aligned with the corresponding vertex of the land pad)
●
Aperture for pins: 0.22 × 0.68 (x32, heel coincides with package pin heel)
■
Via placement and connections:
●
Place thermal/ground via in space close to each thermal pad.
●
Connect each via with a thermal pattern with a trace for a low impedance connection. Via size and trace
width are per each design’s DCR.
Figure 9. 32-LGA Land Pattern Dimensions
