VC7 PCB Layout Guidelines Manual
R31UH0017EU0100 Rev.1.00
Aug 4, 2022
Page 7
4.2
RC21012A/RC21012A – QFN-48
[4]
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Device land pattern is shown below
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PCB pad width: 0.20mm
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PCB pad length: 0.55mm
○
Toe extension (beyond package edge): 0.05mm
○
Heel extension (toward package center): 0mm
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Stencil recommendations (Unit: mm)
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Thickness: 0.125
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Aperture for thermal pads: 2.3 × 2.3 (x4, 200um gap between apertures; centered on land pad).
Note
: We recommend 4x 2.3 × 2.3 mm solder paste pads instead of a big, single pad to avoid excessive
copper.
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Aperture for pins: 0.20 × 0.58 (x48, heel coincides with package pin heel)
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Via placement and connections:
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Place as many thermal/ground vias as fit in each of the 4 split pads.
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This implementation is called via-in-pad, which is the option for this package as there is no extra space for
the vias outside of pads.
Figure 8. QFN-48 Land Pattern Dimensions
