LPWA Module Series
BG950A-GL&BG951A-GL_Hardware_Design
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8.2. Recommended Footprint
40x1.0
40x1.0
62x0.7
62x1.10
19.90±0.20
23
.6
0±
0.
20
9.95
9.95
7.45
7.15
0.55
1.95
1.10
1.10
9.15
9.15
0.25
1.00
1.00
1.9
0
11
.8
0
11
.8
0
11
.0
0
11
.0
0
1.70
0.85
1.70
0.85
1.70
5.9
5
5.9
5
4.2
5
4.2
5
7.6
5
7.6
5
9.7
0
9.6
0
1.70
0.85
2.55
4.25
5.95
4.25
5.95
1.7
0
1.70
2.50
2.50
1.10
1.10
1.10
1.10
1.10
0.70
1.00
1.00
0.25
0.25
0.25
0.2
0
0.15
Figure 34: Recommended Footprint (Top View)
.
1.
For easy maintenance of the module, keep about 3 mm between the module and other
components on the motherboard.
2. All reserved pins must be kept open.
3. For stencil design requirements of the module, see
document [6].
NOTE
Pin1
