Quectel FC64E, Hardware Design

Page: 8 / 59

Wi-Fi&Bluetooth Module Series
FC64E_Hardware_Design 7 / 53
4.5.1. Power Consumption in Low Power Modes ....................................................................40
4.5.2. Power Consumption .......................................................................................................40
4.6. RF Performances .......................................................................................................................42
4.6.1. Conducted RF Output Power .........................................................................................42
4.6.2. Conducted RF Receiving Sensitivity ..............................................................................44
4.7. Bluetooth RF Performances ...................................................................................................... 45
4.7.1. Conducted RF Output Power .........................................................................................45
4.7.2. Conducted RF Receiving Sensitivity ..............................................................................46
4.8. ESD ............................................................................................................................................46
5 Mechanical Information ..................................................................................................................... 47
5.1. Mechanical Dimensions .............................................................................................................47
5.2. Recommended Footprint ...........................................................................................................49
5.3. Top and Bottom Views .............................................................................................................. 50
6 Storage, Manufacturing and Packaging .......................................................................................... 51
6.1. Storage Conditions .................................................................................................................... 51
6.2. Manufacturing and Soldering .................................................................................................... 52
6.3. Packaging Specifications ...........................................................................................................53
6.3.1. Carrier Tape ................................................................................................................... 54
6.3.2. Plastic Reel .....................................................................................................................54
6.3.3. Packaging Process .........................................................................................................55
7 Appendix References .........................................................................................................................56