Pulsar TCF-10B, System Manual, Page: 98 / 249

8.5.1 Preliminary Precautions
1. To avoid damage to circuits and components
from a current surge, disconnect power before
replacing or removing components or circuits.
2. Before placing new components into a
defective circuit, check the circuit so that it
cannot damage the new components.
8.5.2 Trouble-Detection Sequence
1. Evaluate test jack readings and other records
of routine alignment.
2. Evaluate any symptoms detected audibly or
visually.
3. Replace suspected plug-in components.
4. Further isolation of faults includes:
• Voltage readings
• Resistance readings
• Signal injection
• Re-alignment
• Sensitivity measurements
• Gain measurements
5. Replace suspected faulty components.
6. Check-out and adjust affected circuits.
8.5.3 Servicing Components
Soldered Directly to Terminals
1. Avoid overheating from soldering by using a
low-wattage soldering iron (60 watt
maximum).
2. Make sure there is no current leakage from the
soldering iron.
You may use an isolation transformer to
prevent current leakage.
3. When soldering leads from transistors or
diodes, use heat sinks, e.g., alligator clips.
4. You can remove molten solder from the board
with a solder-sucker.
5. When removing a multi-lead component from
a printed circuit board, first cut all leads and
then remove the leads individually (to prevent
overheating). If there are only a few leads,
you can use a broad-tip soldering iron.
December 1996 Page 8–3
Chapter 8. Maintenance
8