SCALE™-2 1SC0450E2B0
Preliminary Description & Application Manual
www.power.com/igbt-driver
Page 19
During power-up, the status feedback will also show a fault condition until the supply under-voltage
protection disappears.
If the OUT terminal is not used, it is recommended to connect the OUT pin to VISO via a pull-up resistor in
the range of 1.5kΩ to 10kΩ.
How Do 1SC0450E2B0 SCALE-2 Drivers Work in Detail?
Power supply and electrical isolation
The driver is equipped with a DC/DC converter to provide an electrically insulated power supply to the gate
driver circuitry. The transformer features basic insulation according to IEC 61800-5-1 as well as IEC 60664-1
between the primary and secondary sides.
Note that the driver requires a stabilized supply voltage.
Power-supply monitoring
The driver’s primary and secondary sides are equipped with a local under-voltage monitoring circuit.
In the event of a primary-side supply under-voltage, the under-voltage is signalized by the electrical status
output SO. A primary-side under-voltage will not automatically cause a gate turn-off command. This
condition has to be detected by the control logic which has to switch off and block the gate drive signal.
In case of a secondary-side supply under-voltage, the corresponding power semiconductor is driven with a
negative gate voltage after the delay in IGBT turn-off (refer to “Input for adjusting the turn-off delay in fault
condition (CSHD)”) to keep it in the off-state (the channel is blocked) and a fault condition is monitored on
the status output OUT until the supply voltage exceeds the reference level for enabling.
Parallel connection of IGBT modules
It is recommended to drive parallel-connected IGBT modules using a single 1SC0450E2B0 driver core.
Appropriate gate circuitry has to be used. Please contact the Power Integrations support service for more
information.
3-level or multilevel topologies
In applications with multi-level topologies, the turn-off sequence of the individual power semiconductors
usually needs to be controlled by the host controller in case of a detected fault condition (e.g. short circuit,
over-current), especially if no Advanced Active Clamping or Dynamic Advanced Active Clamping is
implemented.
In that case, the turn-off delay in the fault condition of the different drivers can be adjusted to match the
corresponding timing specifications. It is in particular possible to determine a specific turn-off delay for the
inner IGBTs of a 3-level NPC topology as described in the section: “Input for adjusting the turn-off delay in
fault condition (CSHD)”. The driver’s response time can also be adapted accordingly if required.
Note however that Advanced Active Clamping offers simple and safe protection that allows excessive
collector-emitter overvoltages to be avoided in case of wrong commutation sequences in the short-circuit
condition of 3-level converter topologies (refer to /6/ and /7/ for more information).