phyCORE-MCF548x
86
PHYTEC Messtechnik GmbH 2005 L-645e_1
12
Hints for Handling the Module
Removal of various components, such as the microcontroller and the
standard quartz, is not advisable given the compact nature of the
module. Should this nonetheless be necessary, please ensure that the
board as well as surrounding components and sockets remain
undamaged while de-soldering. Overheating the board can cause the
solder pads to loosen, rendering the module inoperable. Carefully heat
neighboring connections in pairs. After a few alternations,
components can be removed with the solder-iron tip. Alternatively, a
hot air gun can be used to heat and loosen the bonds.
Integrating the phyCORE-MCF548x in Application Circuitry
Successful integration in user target circuitry depends on whether the
layout for the GND connections matches those of the phyCORE
module. It is recommended that the target application circuitry is
equipped with one layer dedicated to carry the GND potential. In any
case, be sure to connect all GND pins neighboring signals which are
used in the application circuitry. For the supply voltage, there must be
contact with at least six of the GND pins neighboring the supply
voltage pins.
Summary of Contents for phyCORE-MCF548x
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Page 104: ...Published by PHYTEC Messtechnik GmbH 2005 Ordering No L 645e_1 Printed in Germany ...