20040914
1-18-2
E9480EL
●
C256
CHIP CERAMIC CAP.(MELF) 470pF/50V
±10% (W)
CZM1JK30B471
4835 122 87203
C258
ELECTROLYTIC CAP. 10
µ
F/16V ±20%
H7
CE1CMAVSL100
4835 124 47268
●
C259
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
●
C260
CHIP CERAMIC CAP. 1
µ
F/10V +80/-20%
(F)
CHD1AZ30F105
4835 122 87639
●
C274
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
C275
ELECTROLYTIC CAP. 47
µ
F/6.3V ±20%
H7
CE0KMAVSL470
4835 124 47265
●
C277
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
●
C278
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
C279
ELECTROLYTIC CAP. 100
µ
F/6.3V H7
CE0KMAVSL101
4835 124 47127
●
C289
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
●
C290
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
●
C292
CHIP CERAMIC CAP.(1608) 100pF/50V
±5% (CH) or
CHD1JJ3CH101
4835 122 87193
CHIP CERAMIC CAP.(1608) 100pF/50V
±5% (CG)
CHD1JJ3CG101
4835 122 87193
●
C293
CHIP CERAMIC CAP.(MELF) 470pF/50V
±10% (W)
CZM1JK30B471
4835 122 87193
●
C294
CHIP CERAMIC CAP.(MELF) 470pF/50V
±10% (W)
CZM1JK30B471
4835 122 87203
●
C297
CHIP CERAMIC CAP.(MELF) 470pF/50V
±10% (W)
CZM1JK30B471
4835 122 87203
●
C298
CHIP CERAMIC CAP.(MELF) 470pF/50V
±10% (W)
CZM1JK30B471
4835 122 87203
●
C299
CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105
4835 122 87639
●
C300
CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105
4835 122 87639
●
C302
CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105
4835 122 87639
●
C303
CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105
4835 122 87639
C304
ELECTROLYTIC CAP. 47
µ
F/6.3V ±20%
H7
CE0KMAVSL470
4835 124 47265
●
C306
CHIP CERAMIC CAP.(1608) 0.033
µ
F/50V
±10% (B) or
CHD1JK30B333
4835 122 87384
CHIP CERAMIC CAP.(1608) 0.033
µ
F/25V
±10% (B)
CHD1EK30B333
4835 122 87221
C307
ELECTROLYTIC CAP. 4.7
µ
F/50V ±20%
H7
CE1JMAVSL4R7
4835 124 97061
●
C308
CHIP CERAMIC CAP.(1608) 0.01
µ
F/50V
±10% (B)
CHD1JK30B103
4835 122 87255
●
C310
CHIP CERAMIC CAP.(1608) 0.01
µ
F/50V
±10% (B)
CHD1JK30B103
4835 122 87255
C312
ELECTROLYTIC CAP. 4.7
µ
F/25V ±20%
H7
CE1EMAVSL4R7
4835 124 47407
●
C316
CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105
4835 122 87639
●
C317
CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105
4835 122 87639
●
C318
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
●
C319
CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105
4835 122 87639
●
C320
CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105
4835 122 87639
●
C321
CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105
4835 122 87639
●
C322
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
Ref. No.
#
Description
ID No.
Part No.
●
C323
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
●
C325
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
●
C326
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
C327
ELECTROLYTIC CAP. 47
µ
F/6.3V ±20%
H7
CE0KMAVSL470
4835 124 47265
●
C328
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
C329
ELECTROLYTIC CAP. 47
µ
F/6.3V ±20%
H7
CE0KMAVSL470
4835 124 47265
C330
ELECTROLYTIC CAP. 10
µ
F/16V ±20%
NP
CP1CMASNC100 ---- --- -----
●
C333
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
●
C334
CHIP CERAMIC CAP.(1608) 0.047
µ
F/50V
±10% (B) or
CHD1JK30B473
4835 122 87162
CHIP CERAMIC CAP.(1608) 0.047
µ
F/25V
±10% (B)
CHD1EK30B473
4835 122 87185
C336
ELECTROLYTIC CAP. 47
µ
F/6.3V ±20%
H7
CE0KMAVSL470
4835 124 47265
●
C341
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
●
C342
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
●
C343
CHIP CERAMIC CAP.(1608) 0.01
µ
F/50V
±10% (B)
CHD1JK30B103
4835 122 87255
●
C345
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
C346
ELECTROLYTIC CAP. 47
µ
F/6.3V ±20%
H7
CE0KMAVSL470
4835 124 47265
●
C347
CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105
4835 122 87639
C348
ELECTROLYTIC CAP. 47
µ
F/16V ±20%
H7
CE1CMAVSL470
4835 124 47073
●
C349
CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105
4835 122 87639
C350
ELECTROLYTIC CAP. 10
µ
F/16V ±20%
H7
CE1CMAVSL100
4835 124 47268
●
C351
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
●
C354
CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105
4835 122 87639
●
C355
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
●
C356
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
●
C357
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
●
C358
CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104
4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104
4835 122 87634
●
C359
CHIP CERAMIC CAP. 27pF/50V ±5%
(CH) or
CHD1JJ3CH270
4835 122 87029
CHIP CERAMIC CAP. 27pF/50V ±5%
(CG)
CHD1JJ3CG270
4835 122 87029
●
C362
CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105
4835 122 87639
C363
ELECTROLYTIC CAP. 4.7
µ
F/25V ±20%
H7
CE1EMAVSL4R7
4835 124 47407
Ref. No.
#
Description
ID No.
Part No.
Summary of Contents for DVDR600VR/37
Page 26: ...1 6 1 E9480IB OPERATING CONTROLS AND FUNCTIONS DVDR600VR 37 ...
Page 27: ...1 6 2 E9480IB ...
Page 28: ...1 6 3 E9480IB ...
Page 29: ...1 6 4 E9480IB MRV700VR 17 ...
Page 30: ...1 6 5 E9480IB ...
Page 31: ...1 6 6 E9480IB ...
Page 32: ...1 7 1 E9480IBR REMOTE CONTROL OPERATION DVDR600VR 37 ...
Page 33: ...1 7 2 E9480IBR ...
Page 34: ...1 7 3 E9480IBR MRV700VR 17 ...
Page 35: ...1 7 4 E9480IBR ...
Page 41: ...1 8 6 E9480DC Fig D9 22 Deck Pedestal 23 Front Bracket R iLink Cable S 25 S 25 S 26 S 27 A ...
Page 91: ...Digital Board Unit Top View DVD Section 1 12 65 1 12 66 ...
Page 92: ...Digital Board Unit Bottom View DVD Section 1 12 67 1 12 68 ...
Page 93: ...Digital Board Unit Test Point View DVD Section 1 12 69 1 12 70 ...
Page 155: ...Directions For Use EN 4 VAD8041 3 3 Directions For Use Not applicable ...
Page 181: ...EN 30 VAD 8041 7 Electrical Diagrams and Print Layouts ...
Page 200: ...Spareparts List EN 49 VAD8041 10 DVD M TR 22003_001 300604 ...