Philips DVDR600VR/37, Service Manual

Page: 108 / 204

20040914 1-18-1 E9480EL
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE: Products marked with a
#
have special characteristics important to safety.
Before replacing any of these components, read care-
fully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
To order parts call the TOLL FREE Philips Sales
Center number: 1 - 800 - 851 - 8885
(In Canada) 1 - 800 - 363 - PART.
1 - 800 - 535 - 3715 (Fax).
NOTES:
1.
Parts that are not assigned part numbers
(---- --- ----- or blank) are not normally available.
2. “
●
”=SMD
CPU CBA UNIT
DIGITAL BOARD UNIT
MCV CBA
MAIN CBA
Ref. No.
#
Description ID No. Part No.
CPU CBA UNIT 1VMN20220 9965 000 25430
Ref. No. # Description ID No. Part No.
DIGITAL BOARD UNIT 1VSA10574 4835 214 38229
Ref. No.
#
Description ID No. Part No.
MCV CBA
Consists of the following: 1VSA10561 9965 000 25434
MAIN CBA (MCV-A)
FUNCTION CBA (MCV-B)
SENSOR CBA --------------
--------------
1VSA10578
9965 000 14801
Ref. No. # Description ID No. Part No.
MAIN CBA (MCV-A)
Consists of the following:: --------------
CAPACITORS
C201 ELECTROLYTIC CAP. 10
µ
F/16V ±20%
NP
CP1CMASNC100 ---- --- -----
C202 ELECTROLYTIC CAP. 10
µ
F/16V ±20%
NP
CP1CMASNC100 ---- --- -----
●
C204 CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105 4835 122 87639
●
C205 CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105 4835 122 87639
●
C206 CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105 4835 122 87639
●
C207 CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105 4835 122 87639
C208 ELECTROLYTIC CAP. 47
µ
F/6.3V ±20%
H7
CE0KMAVSL470 4835 124 47265
●
C209 CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104 4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104 4835 122 87634
C211 ELECTROLYTIC CAP. 47
µ
F/6.3V ±20%
H7
CE0KMAVSL470 4835 124 47265
C212 ELECTROLYTIC CAP. 47
µ
F/6.3V ±20%
H7
CE0KMAVSL470 4835 124 47265
●
C214 CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104 4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104 4835 122 87634
C215 ELECTROLYTIC CAP. 47
µ
F/6.3V ±20%
H7
CE0KMAVSL470 4835 124 47265
●
C216 CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104 4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104 4835 122 87634
●
C217 CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105 4835 122 87639
●
C218 CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105 4835 122 87639
●
C219 CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105 4835 122 87639
●
C220 CHIP CERAMIC CAP.(1608) 1
µ
F/10V
±10% (B)
CHD1AK30B105 4835 122 87639
●
C221 CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104 4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104 4835 122 87634
●
C222 CHIP CERAMIC CAP.(1608) 0.01
µ
F/50V
±10% (B)
CHD1JK30B103 4835 122 87255
C223 ELECTROLYTIC CAP. 47
µ
F/6.3V ±20%
H7
CE0KMAVSL470 4835 124 47265
●
C224 CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104 4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104 4835 122 87634
●
C225 CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104 4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104 4835 122 87634
C226 ELECTROLYTIC CAP. 47
µ
F/6.3V ±20%
H7
CE0KMAVSL470 4835 124 47265
●
C227 CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104 4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104 4835 122 87634
●
C230 CHIP CERAMIC CAP.(1608) 47pF/50V
±5% (CH) or CHD1JJ3CH470 4835 122 87148
CHIP CERAMIC CAP. 47pF/50V ±5%
(CG) CHD1JJ3CG470 4835 122 87034
C232 ELECTROLYTIC CAP. 47
µ
F/6.3V ±20%
H7
CE0KMAVSL470 4835 124 47265
C233 ELECTROLYTIC CAP. 47
µ
F/6.3V ±20%
H7
CE0KMAVSL470 4835 124 47265
●
C235 CHIP CERAMIC CAP.(MELF) 470pF/50V
±10% (W) CZM1JK30B471 4835 122 87203
●
C236 CHIP CERAMIC CAP.(1608) 1000pF/50V
±10% (B) CHD1JK30B102 4835 122 87153
●
C238 CHIP CERAMIC CAP.(1608) 4700pF/50V
±10% (B) CHD1JK30B472 4835 122 87326
●
C239 CHIP CERAMIC CAP.(1608) 4700pF/50V
±10% (B) CHD1JK30B472 4835 122 87326
●
C240 CHIP CERAMIC CAP.(1608) 4700pF/50V
±10% (B) CHD1JK30B472 4835 122 87326
●
C241 CHIP CERAMIC CAP.(1608) 4700pF/50V
±10% (B) CHD1JK30B472 4835 122 87326
●
C242 CHIP CERAMIC CAP.(1608) 1000pF/50V
±10% (B) CHD1JK30B102 4835 122 87153
●
C243 CHIP CERAMIC CAP.(MELF) 470pF/50V
±10% (W) CZM1JK30B471 4835 122 87203
CHIP CERAMIC CAP. 27pF/50V +/-5%
(CG) CHD1JJ3CG270 4835 122 87029
●
C244 CHIP CERAMIC CAP.(1608) 0.01
µ
F/50V
±10% (B)
CHD1JK30B103 4835 122 87255
●
C247 CHIP CERAMIC CAP. 27pF/50V ±5%
(CH) or CHD1JJ3CH270 4835 122 87029
CHIP CERAMIC CAP. 27pF/50V ±5%
(CG) CHD1JJ3CG270
●
C248 CHIP CERAMIC CAP.(1608) 0.1
µ
F/25V
±10% (B) or
CHD1EK30B104 4835 122 87213
CHIP CERAMIC CAP.(1608) 0.1
µ
F/16V
±10% (B)
CHD1CK30B104 4835 122 87634
C249 ELECTROLYTIC CAP. 10
µ
F/16V ±20%
NP
CP1CMASNC100 ---- --- -----
C250 ELECTROLYTIC CAP. 10
µ
F/16V ±20%
NP
CP1CMASNC100 ---- --- -----
●
C252 CHIP CERAMIC CAP.(MELF) 470pF/50V
±10% (W) CZM1JK30B471 4835 122 87203
●
C253 CHIP CERAMIC CAP.(MELF) 470pF/50V
±10% (W) CZM1JK30B471 4835 122 87203
●
C255 CHIP CERAMIC CAP.(MELF) 470pF/50V
±10% (W) CZM1JK30B471 4835 122 87203
Ref. No.
#
Description ID No. Part No.