7.6 Touch Control Criteria
•
NA
7.7 Bezel and Tray loader design
7.7.1 Strength
Permissible load on Bezel in any direction is
≥
50N.The Tray & Bezel should not be broken or permanently deformed,
nor cause damage to other parts of set. The Bezel may dislodge above 30N without suffering any damage, and the
user must be able to easily put the Bezel back. Dislodge of the Bezel shall not cause damage to the set.
7.7.2
Actuating force needed for Tray
Force needed to actuate the tray should be
≤
5N.
7.7.3
Tray Movement Cycle (Life Test)
24,000 open / close cycles
7.7.4 Tray
Dimension
Refer to Appendix A.Disc should be fully out at tray open position.
7.8 Shock
Sensitivity
Requirement:
No muting, plop sounds, picture freeze/jerk or audible/visible interference when impacting with force of -
In the
±
X and
±
Y directions:
F
≥
6g / 3ms,
Δ
V = 0.06ms
In the
±
Z direction:
F
≥
4g / 3ms,
Δ
V = 0.04ms
where g = acceleration due to gravity
Refer to ODM Quality & Reliability handbook [6] for the details of the test discs and testing method.
7.9 Thermal
Performance
Requirements:
1. Set should function normally
2. Temperature rise of PCB prints shall not exceed 85˚C
3. Temperature readings of all mechanical / electrical components and modules shall not exceed their
specification limits. The calculated junction temperature of semiconductors shall also not exceed spec
limits.
Refer to “ODM Quality & Reliability handbook [6] – Thermal Stability Test for player” for the details of the testing
method.
7.10 Dust Injection Test
Refer to “ODM Quality & Reliability handbook [6] – Dust Test”for details of the dust specifications and test
procedures.
2-8
