76570EM 3
DISASSEMBLY AND ASSEMBLY
Outline of Disassembly and Assembly
1. Caution
(1) Be sure to use the conductive mat and wrist strap to prevent static failure of circuits.
(2) This product is used
lead-free solder.
Surface of solder will be white-tinged color. Solder quickly, because melting temperature
is high and so if heat to much, it is possible to damage to PC board.
Soldering iron requirement: The temperature can be adjusted up to 400º and exclusive
use
for lead free solder.
Also it is desirable to use antistatic soldering iron.
The temperature for tip of soldering iron must set between 340º ~ 360º for
lead free solder.
(3) Do not stress to the connector terminals and flexible boards because they are very delicate
parts.
Pay attention to the connector terminals and flexible boards
And, we recommend marking to the flexible board before disconnecting them. This will be
helpful to reconnect the flexible board to the connector terminal properly.
2. Flowchart for Assemble, Adjustment and Confirmation
2. ASSEMBLY AND DISASSEMBLY PROCEDURE OF FRONT HOUSING.................
16
(1) FRONT HOUSING BLOCK.......................................................................................
16
(2) 0-M22...........................................................................................................................
16
(3) 0-G100.........................................................................................................................
17
(4) [CONFIRM] CHECKING THE MIRROR FUNCTION................................................
19
(5) A104............................................................................................................................
19
(6) [ADJUST] POSITIONING 1ST AND 2ND MIRROR...................................................
20
(
7
)
0-L3 AND L2...............................................................................................................
21
(8) M301............................................................................................................................
21
(9) [ADJUST] VIEWFINDER FOCUS AND PARALLAX..................................................
22
(10) M51............................................................................................................................
22
(11) [ADJUST] POSITIONING 0-O170 (SI-LED)..............................................................
23
(12) 0-O100.......................................................................................................................
23
(13) [ADJUST] POSITIONING 0-O100 (VIEWFINDER INDICATIONS).......................
24
13-1. PREPARATION......................................................................................................
24
13-2. ADJUSTMENT.......................................................................................................
25
(14) 0-J201........................................................................................................................
26
(15) 0-S300........................................................................................................................
26
(16) [ADJUST] AF JOINT STROKE...............................................................................
26
(17) 0-M100.......................................................................................................................
26
(18) 0-J100........................................................................................................................
27
(19) 0-T940........................................................................................................................
27
3. ASSEMBLY PROCEDURE OF MAIN BODY................................................................
28
(1) BASE PLATE OF BODY AND BATTERY CHAMBER............................................
28
(2) 0-E000 (SHUTTER BLOCK).....................................................................................
28