"ELECTROSTATICALLY SENSITIVE (ES) DEVICES" section of this service manual.
5.1.16. REPLACEMENT PROCEDURE FOR LEADLESS (CHIP) COMPONENTS
The following procedures are recommended for the replacement of the leadless components
used in this unit.
1. Preparation for replacement
A. Soldering Iron
Use a pencil-type soldering iron that uses less than 30 watts.
B. Solder
Eutectic Solder (Tin 63 %, Lead 37 %) is recommended.
C. Soldering time
Do not apply heat for more than 4 seconds.
D. Preheating
Leadless capacitor must be preheated before installation. - (266
°F ~ 302 °F)
(130 °C ~150 °C) for about 2 minutes.
Note:
A. Leadless components must not be reused after removal.
B. Excessive mechanical stress and rubbing of the component
electrode must be avoided.
2. Removing the leadless component
Grasp the leadless component body with tweezers and alternately
apply heat to both electrodes. When the solder on both electrodes
is melted, remove the leadless component with a twisting motion.
Note:
A. Do not attempt to lift the component off the board until the
component is completely disconnected from the board by a
twisting action.
B. Be careful not to break the copper foil on the printed circuit
board.
Fig. 10-1
3. Installing the leadless component
A. Presolder the contact points on the circuit board.
Fig. 10-2
18
Summary of Contents for Omnivision PV-V4621
Page 6: ...Fig 1 3 Fig 1 4 Fig 1 5 6 ...
Page 26: ...6 2 2 Inner Parts Location Fig J1 1 26 ...
Page 27: ...6 2 3 EJECT Position Confirmation Fig J1 2 27 ...
Page 58: ...11 2 MECHANISM BOTTOM SECTION 58 ...
Page 59: ...11 3 CASSETTE UP COMPARTMENT SECTION 59 ...
Page 60: ...11 4 CHASSIS FRAME AND CASING PARTS SECTION 60 ...
Page 61: ...11 5 PACKING PARTS AND ACCESSORIES SECTION 61 ...