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6) During the Reflow phase, the Bottom Side heater provides a 30
°
C
temperature spike to aid in the reflow process. This is an automatic
feature and can be disabled by entering “61” seconds in the
Preheat time field prior to the start of the reflow cycle. The “SPIKE”
allows for more even heating of PCB and Device as well as lower
“REFLOW” temperatures.
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