System Operations Manual
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xviii.
Allow the PCB to cool and remove.
b. Component removal – Note: If at any time you need to abort the process mouse
click on the Red Home button.
i. Mouse click on Production to switch to the production screen. (Figure 6)
ii. Select a removal profile from the “Load Profile” drop down box .
iii. Install the proper vacuum pick. (Para. 5d)
iv. Install the proper nozzle. (Para. 5e)
v. Place the PCB between the arms on the board holder and tighten the
retention screw. (Figure 16) Position the board so the red laser sighting
light is roughly in the center of the component. To move the board
forward and back simply move the PCB in the arms. To move the
assembly left and right push the release handle away from you and
move the assembly. Pull the release handle towards you to secure the
assembly. (Figure 22)
Figure 22
vi. Mouse click on Start button.
vii. Allow PCB and component to cool before removing.
c. Profile development installation procedure.
Note:
General Information concerning the Profile Development Screen
The Reflow Graph area displays a representation of the Reflow cycle profile.
Time in minutes is graphed along the X-axis and temperature is plotted along the Y-
axis. The time and temperature axes incorporate a dynamic scaling feature to
optimize the display. Profile graphs can be saved with profiles to be used for process
validation by operators while using the Operation screen. Profile graphs can also be
stored as individual records for each rework job for quality control purposes. Colored
lines are used to indicate profile parameters on the graph.
Profile Creation
There are 2 recommended methods for developing a profile. The first, involves an
actual component installation, while the second uses a previously installed package.
Either method can be used to develop a reliable profile. However, there are some
issues and considerations to be aware of with each.
When developing profiles through actual component installation, it is critical to make
sure the thermocouples remain in contact with the solder throughout the entire
process. Unreliable data could be collected should a thermocouple lose contact with
the solder. If measuring the temperature on the top of the package, it is best to use