Orbotech DP-100SL, Site Preparation Manual

Page: 9 / 54

DP-100SL 3
Site Preparation Guide
Intended Use
The DP-100SL is intended for the manufacturing of printed circuit boards.
It is designed to allow exposure of UV-sensitive resists, films, and similar
materials typical of the circuit board industry. However, because of the
numerous interrelations between substrate and laser imaging as the
exposing technique, the system may only be used with such UV-sensitive
materials that have been specifically approved by the manufacturer.
Approved materials are listed in Appendix A— Approved Materials .
Substrate dimensions with resist:
• max. substrate size 660.4 mm x 812.8 mm (26" x 32")
• max. exposable area 609.6 mm x 812.8 mm (24" x 32")
• max. substrate thickness 5 mm (0.196")
The machine must not be used in any way other than specified in this
manual or in the DP-100SL User Guide .
Safety Considerations
The DP-100SL is a Class 1 laser product containing high-voltage power
supplies and laser light sources. There is no danger to persons or
equipment when the system is operated in accordance with the directions
provided by Orbotech in this and other publications. All high-voltage
power supplies and laser sources are located behind protective panels.
During system service, with panels removed, the system may reach Class
4 laser radiation . Under those conditions, the imager room should have
fireproof walls and furniture and should be locked from the inside. During
service a red warning light on the outside of the room should be activated,
and all personnel in the vicinity of the system must wear protective
goggles. For a description of the safety requirements in the site, refer to
Chapter 3— Facility Physical Requirements .