O P T E K
D P L - 2 4
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SUBSTRATE SPECIFICATIONS
Productivity:
Cycle time is adjustable from 0 to infinity and is determined by application
parameters such as circuit complexity, ground plane areas, circuit heights, flow
temperatures, etc. Typical times for a dry-film solder mask application would be 30
seconds for Vacuum Dwell and 20 seconds for Pressure Dwell.
Substrate size:
Items up to 24" X 24" can be laminated. Smaller substrates can be
processed in multiples if space permits and can be intermixed providing adequate
hold-down techniques are observed.
Substrate Thickness:
Thicknesses from .001" to .375" can be accommodated though standard
board hold-down bars .
